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公开(公告)号:US3573975A
公开(公告)日:1971-04-06
申请号:US3573975D
申请日:1968-07-10
Applicant: IBM
Inventor: DHAKA VIR A , CLARK EDWIN R , PINCK ARNOLD
CPC classification number: G03F7/2041
Abstract: IN A PHOTOCHEMICAL FABRICATION PROCESS WHEREIN A PHOTORESIST LAYER IS IMAGE-WISE EXPOSED BY CONTACT EXPOSURE THROUGH A MASK, THE IMPROVEMENT OF PROVIDING A LIQUID INTERFACE BETWEEN THE PHOTORESIST LAYER AND MASK PRIOR AND DURING EXPOSURE.