-
公开(公告)号:US20250011010A1
公开(公告)日:2025-01-09
申请号:US18705510
申请日:2022-10-21
Applicant: IDEMITSU KOSAN CO., LTD.
Inventor: Kyohei HORIGUCHI , Mikio HAMANO , Motoshi NAKAMURA
IPC: B64G1/44 , H01L31/043 , H01L31/05 , H01L31/18
Abstract: Provided is a photoelectric conversion module capable of connecting photoelectric conversion elements with stable connection strength. The photoelectric conversion module (100) comprises a first photoelectric conversion element (10a), a second photoelectric conversion element (10b) and a connector (200). The first photoelectric conversion element (10a) and the second photoelectric conversion element (10b) are arranged side by side so as to partially overlap each other. The connector (200) is connected to the first photoelectric conversion element (10a) at a first connection portion (210). The connector (200) is connected to the second photoelectric conversion element (10b) at a second connection portion (10b) away from the first connection portion (10a).
-
2.
公开(公告)号:US20250048822A1
公开(公告)日:2025-02-06
申请号:US18719749
申请日:2022-12-08
Applicant: IDEMITSU KOSAN CO.,LTD. , THE UNIVERSITY OF TOKYO
Inventor: Motoshi NAKAMURA , Issei TAKENAKA , Hiroshi SEGAWA , Keishi TADA , Takeru BESSHO
Abstract: A photoelectric conversion element includes a light absorbing layer, a hole transport layer that transports holes generated by photoexcitation of the light absorbing layer, and a transparent conductive layer that is in contact with the hole transport layer and receives holes from the hole transport layer. The carrier density of the transparent conductive layer is more than 1×1016 cm−3 and 1×1020 cm−3 or less.
-
公开(公告)号:US20240405140A1
公开(公告)日:2024-12-05
申请号:US18697084
申请日:2022-09-29
Applicant: IDEMITSU KOSAN CO.,LTD.
Inventor: Kyohei HORIGUCHI , Motoshi NAKAMURA , Mikio HAMANO
IPC: H01L31/05 , B64G1/44 , H01L31/0392 , H01L31/18
Abstract: Provided is a photoelectric conversion module capable of improving bonding strength between photoelectric conversion elements adjacent to each other. The photoelectric conversion module (100) comprises a first photoelectric conversion element (10a) including a collector electrode (30a) and a second photoelectric conversion element (10b) including a conductive substrate (20b). The first photoelectric conversion element (10a) and the second photoelectric conversion element (10b) are arranged side by side so as to partially overlap each other. The photoelectric conversion module comprises a conductor (200) electrically connecting the collector electrode (30a) of the first photoelectric conversion element (10a) and the conductive substrate (20b) of the second photoelectric conversion element (10b) to each other. The conductor (200) is provided from a region of the collector electrode (30a) of the first photoelectric conversion element (10a) to a region outside the collector electrode (30a).
-
-