公开(公告)号：US11647568B2

公开(公告)日：2023-05-09

申请号：US15995903

申请日：2018-06-01

Applicant: IM ADVANCED MATERIALS CO., LTD

Inventor： Ji Hun Park ,  Seung Yeon Lee ,  Seong Hwan Lim ,  Yeo Jo Yoon ,  Hye Jin Kim

IPC: F24C15/32 ,  F24C15/20 ,  H05B3/86 ,  H05B3/14 ,  H05B3/16 ,  H04N23/52 ,  H04N23/57

CPC classification number: H05B3/86 ,  H04N23/52 ,  H04N23/57 ,  H05B3/141 ,  H05B3/16 ,  H05B2214/02

Abstract: Disclosed is a heating device, including a substrate, a metal oxide layer formed on the substrate, hyper heat accelerator dots having a spherical shape formed on the metal oxide layer and arranged in a lattice form, and a conductive adhesive layer formed on the metal oxide layer and the hyper heat accelerator dots, wherein the lower portions of the hyper heat accelerator dots having a spherical shape are included in the metal oxide layer and the upper portions thereof are included in the conductive adhesive layer.