公开(公告)号：US20220270924A1

公开(公告)日：2022-08-25

申请号：US17669255

申请日：2022-02-10

Applicant: IMEC VZW

Inventor： Douglas Charles La Tulipe ,  Anne Jourdain ,  Gaspard Hiblot

IPC: H01L21/768 ,  H01L23/544

Abstract: The disclosed technology relates to methods for producing an interconnect structure on the back side of an integrated circuit chip. According to a first aspect, a via opening is etched in a top semiconductor layer, and filled with a sacrificial material, thereby forming a sacrificial pillar. Then front and back end of line portions are processed and the substrate is thinned. The etch stop layer and the sacrificial pillar are removed, and replaced an electrically conductive material forming a through semiconductor via. According to a second aspect, the sacrificial pillar is etched through the opening of a trench that intersects the pillar. Filling the trench with a conductive material also fills the cavity created by etching back the pillar resulting in an integral conductive pad and interconnect rail structure. The pillar can be removed and replaced by a conductive material, thereby creating the TSV connection.

公开(公告)号：US11886014B2

公开(公告)日：2024-01-30

申请号：US17522203

申请日：2021-11-09

Applicant: IMEC VZW ,  Katholieke Universiteit Leuven, KU LEUVEN R&D ,  Universiteit Gent

Inventor： Junwen He ,  Joris Van Campenhout ,  Geert Van Steenberge ,  Jeroen Missinne ,  Yigit Yilmaz ,  Do Won Kim ,  Douglas Charles La Tulipe

IPC: G02B6/36 ,  G02B6/12 ,  G02B6/132 ,  G02B6/42

CPC classification number: G02B6/36 ,  G02B6/12004 ,  G02B6/132 ,  G02B6/4214

Abstract: A silicon-based photonic chip is provided that includes an interface for optically coupling the photonic chip to an optical fiber or an optical fiber assembly. The interface includes: a single-mode waveguide configured to guide light and to provide a first light beam; a first optical element configured to expand the light beam in a first direction in-plane of the photonic chip, thereby providing an expanded light beam; and a second optical element configured to deflect and to further expand the expanded light beam in a second direction, thereby providing an output light beam from the photonic chip. Also provided are methods for fabricating such a photonic chip.

公开(公告)号：US20220146756A1

公开(公告)日：2022-05-12

申请号：US17522203

申请日：2021-11-09

Applicant: IMEC VZW ,  Katholieke Universiteit Leuven, KU LEUVEN R&D ,  Universiteit Gent

Inventor： Junwen He ,  Joris Van Campenhout ,  Geert Van Steenberge ,  Jeroen Missinne ,  Yigit Yilmaz ,  Do Won Kim ,  Douglas Charles La Tulipe

IPC: G02B6/36 ,  G02B6/12 ,  G02B6/42 ,  G02B6/132

Abstract: A silicon-based photonic chip is provided that includes an interface for optically coupling the photonic chip to an optical fiber or an optical fiber assembly. The interface includes: a single-mode waveguide configured to guide light and to provide a first light beam; a first optical element configured to expand the light beam in a first direction in-plane of the photonic chip, thereby providing an expanded light beam; and a second optical element configured to deflect and to further expand the expanded light beam in a second direction, thereby providing an output light beam from the photonic chip. Also provided are methods for fabricating such a photonic chip.