公开(公告)号：US20170294448A1

公开(公告)日：2017-10-12

申请号：US15479633

申请日：2017-04-05

Applicant: IMEC VZW

Inventor： Peter Debacker ,  Praveen Raghavan ,  Vassilios Constantinos Gerousis

IPC: H01L27/118

Abstract: An integrated circuit (IC) power distribution network is disclosed. In one aspect, the IC includes a stack of layers formed on a substrate. The IC includes standard cells with parallel gate structures oriented in a direction y. Each cell includes an internal power pin for supplying a reference voltage to the cell. The stack includes metal layers in which lines are formed to route signals between cells. The lines in each metal layer have a preferred orientation that is orthogonal to that of the lines in an adjacent metal layer. A first layer is the lowest metal layer that has y as a preferred orientation while also providing routing resources for signal routing between the cells. A second layer is the nearest metal layer above this first layer. The IC includes a power distribution network for delivering the reference voltage to the power pin.

公开(公告)号：US10510774B2

公开(公告)日：2019-12-17

申请号：US15479633

申请日：2017-04-05

Applicant: IMEC VZW

Inventor： Peter Debacker ,  Praveen Raghavan ,  Vassilios Constantinos Gerousis

IPC: H01L27/118 ,  H01L23/528 ,  H01L27/02

Abstract: An integrated circuit (IC) power distribution network is disclosed. In one aspect, the IC includes a stack of layers formed on a substrate. The IC includes standard cells with parallel gate structures oriented in a direction y. Each cell includes an internal power pin for supplying a reference voltage to the cell. The stack includes metal layers in which lines are formed to route signals between cells. The lines in each metal layer have a preferred orientation that is orthogonal to that of the lines in an adjacent metal layer. A first layer is the lowest metal layer that has y as a preferred orientation while also providing routing resources for signal routing between the cells. A second layer is the nearest metal layer above this first layer. The IC includes a power distribution network for delivering the reference voltage to the power pin.