Integrated circuit power distribution network

    公开(公告)号:US10510774B2

    公开(公告)日:2019-12-17

    申请号:US15479633

    申请日:2017-04-05

    Applicant: IMEC VZW

    Abstract: An integrated circuit (IC) power distribution network is disclosed. In one aspect, the IC includes a stack of layers formed on a substrate. The IC includes standard cells with parallel gate structures oriented in a direction y. Each cell includes an internal power pin for supplying a reference voltage to the cell. The stack includes metal layers in which lines are formed to route signals between cells. The lines in each metal layer have a preferred orientation that is orthogonal to that of the lines in an adjacent metal layer. A first layer is the lowest metal layer that has y as a preferred orientation while also providing routing resources for signal routing between the cells. A second layer is the nearest metal layer above this first layer. The IC includes a power distribution network for delivering the reference voltage to the power pin.

    ANALOG IN-MEMORY COMPUTING BASED INFERENCE ACCELERATOR

    公开(公告)号:US20220076737A1

    公开(公告)日:2022-03-10

    申请号:US17447131

    申请日:2021-09-08

    Applicant: IMEC vzw

    Abstract: A compute cell for in-memory multiplication of a digital data input and a balanced ternary weight, and an in-memory computing device including an array of the compute cells, are provided. In one aspect, the compute cell includes a set of input connectors for receiving modulated input signals representative of a sign and a magnitude of the data input, and a memory unit configured to store the ternary weight. A logic unit connected to the set of input connectors and the memory unit receives the data input and the ternary weight. The logic unit selectively enables one of a plurality of conductive paths for supplying a partial charge to a read bit line during a compound duty cycle of the set of input signals as a function of the respective signs of data input and ternary weight, and disables each of the plurality of conductive paths if at least one of the ternary weight and data input have zero magnitude.

    INTEGRATED CIRCUIT POWER DISTRIBUTION NETWORK

    公开(公告)号:US20170294448A1

    公开(公告)日:2017-10-12

    申请号:US15479633

    申请日:2017-04-05

    Applicant: IMEC VZW

    Abstract: An integrated circuit (IC) power distribution network is disclosed. In one aspect, the IC includes a stack of layers formed on a substrate. The IC includes standard cells with parallel gate structures oriented in a direction y. Each cell includes an internal power pin for supplying a reference voltage to the cell. The stack includes metal layers in which lines are formed to route signals between cells. The lines in each metal layer have a preferred orientation that is orthogonal to that of the lines in an adjacent metal layer. A first layer is the lowest metal layer that has y as a preferred orientation while also providing routing resources for signal routing between the cells. A second layer is the nearest metal layer above this first layer. The IC includes a power distribution network for delivering the reference voltage to the power pin.

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