公开(公告)号：US11362061B2

公开(公告)日：2022-06-14

申请号：US16906387

申请日：2020-06-19

申请人： IMEC vzw ,  Katholieke Universiteit Leuven

发明人： Lin Hou ,  Jaber Derakhshandeh ,  Eric Beyne ,  Ingrid De Wolf ,  Giovanni Capuz

IPC分类号： H01L23/00

摘要： A method is disclosed for electrically bonding a first semiconductor component to a second semiconductor component, both components including arrays of contact areas. In one aspect, prior to bonding, layers of an intermetallic compound are formed on the contact areas of the second component. The roughness of the intermetallic layers is such that the intermetallic layers include cavities suitable for insertion of a solder material in the cavities, under the application of a bonding pressure, when the solder is at a temperature below its melting temperature. The components are aligned and bonded, while the solder material is applied between the two. Bonding takes place at a temperature below the melting temperature of the solder. The bond can be established only by the insertion of the solder into the cavities of the intermetallic layers, and without the formation of a second intermetallic layer.