公开(公告)号：US11064137B2

公开(公告)日：2021-07-13

申请号：US16232486

申请日：2018-12-26

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Tai-Jie Yun ,  Cheng-Da Ko ,  Ke-Jen Lin ,  Chih-Jen Chen

IPC: H04N5/30 ,  H04N5/247

Abstract: A dual-view image device for monitoring a heat source includes a first thermal image sensor, a second thermal image sensor, a driver and a processor. The first thermal image sensor captures a first thermal image having a heat source within a first view angle. The second thermal image sensor captures a second thermal image having a heat source within a second view angle smaller than the first view angle. The pixels occupied by the heat source in the first thermal image are fewer than that occupied by the heat source in the second thermal image. The driver drives the first and the second thermal image sensor to track and position the heat source within the first and the second view angle. The processor combines the first and the second thermal image into a dual-view image and outputs the dual-view image having the heat source.