公开(公告)号：US20190189886A1

公开(公告)日：2019-06-20

申请号：US15843297

申请日：2017-12-15

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yion-Ni LIU ,  Hsu-Shen CHU ,  Cheng-Ting HSU

IPC: H01L35/32 ,  H01L35/10 ,  H05B3/06

CPC classification number: H01L35/32 ,  H01L35/10 ,  H05B3/06

Abstract: A power supplying device and a heating system are disclosed. The power supplying device includes a first base, a thermoelectric transmitting module, a conducting circuit, and a second base. The first base has a first flow path and a supporting surface. The thermoelectric transmitting module is disposed on the supporting surface. The conducting circuit is disposed on the supporting surface and electrically connected to the thermoelectric transmitting module. At least one portion of a projection of the first flow path to the supporting surface overlaps the conducting circuit. The second base is stacked on the thermoelectric transmitting module, and the thermoelectric transmitting module is positioned between the first base and the second base. The heating system includes the power supplying device and a heater powered by the power supplying device.