Abstract:
An electrical impedance imaging sensing system includes a signal processing device, a sensing element and a processor. The signal processing device is electrically coupled to the sensing element and configured for outputting an emission signal. Each of N electrodes of the sensing element is configured to receive a received signal after the emission signal passes through a to-be tested object. The processor is configured to determine whether one of the N electrodes fails according to a plurality of the received signal; in response to the failure of the electrode, compensate the received signal of the failed electrode; and generate an electrical impedance image pre-processing data according to the received signal.
Abstract:
An ultrasound imaging system includes a beam receiving circuit and a back-end circuit. The beam receiving circuit receives a plurality of digitized echo signals. The back-end circuit is coupled to the beam receiving circuit for outputting a plurality of compressed delay timing parameters corresponding to a plurality of channels to the beam receiving circuit. The beam receiving circuit decompresses the compressed delay timing parameters into a plurality of delay timing parameters, and processes the digitized echo signals into an ultrasound beamforming value according to the delay timing parameters corresponding to the channels. The back-end circuit synthesizes an ultrasound image according to the ultrasound beamforming value outputted from the beam receiving circuit.