公开(公告)号：US20230170288A1

公开(公告)日：2023-06-01

申请号：US17694445

申请日：2022-03-14

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yu-Wei HUANG ,  Shau-Fei CHENG

IPC: H01L23/498

CPC classification number: H01L23/49838 ,  H01L23/49816

Abstract: This disclosure provides a conductive circuit carrier module including a carrier and a conductive circuit film layer. The conductive circuit film layer is disposed on the carrier. The conductive circuit film layer has at least one conductive circuit structure including a vertical wire part and at least four horizontal wire parts. The vertical wire part extends along a thickness direction of the conductive circuit film layer. The at least four horizontal wire parts are connected to one another via the vertical wire part and extend along a direction substantially perpendicular to the vertical wire part. The at least four horizontal wire parts are symmetrically arranged or asymmetrically arranged with respect to the vertical wire part.