公开(公告)号：US20150187123A1

公开(公告)日：2015-07-02

申请号：US14141191

申请日：2013-12-26

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Tsung-Ling HWANG ,  Shau-Yin TSENG ,  Tai-Hua LU

IPC: G06T15/40 ,  G06T1/20

CPC classification number: G06T1/20 ,  G06T15/005

Abstract: An exemplary embodiment describes a method for tile elimination, including: reading in data of a new tile; reading signature values corresponding to the new tile from a signature value repository; generating signature values for the new tile; comparing the read signature values and the generated signature values of the same tile to determine whether the two sets of signature values being identical; when the two sets of signature values being identical, copying the new tile directly from a tile frame buffer without rendering; otherwise, updating the signature value repository with the generated signature values replacing the stored signature values; rendering the tile; and updating the tile frame buffer with the newly rendered tile.

Abstract translation: 示例性实施例描述了一种用于瓦片消除的方法，包括：读取新瓦片的数据; 从签名值库读取对应于新瓦片的签名值; 生成新图块的签名值; 比较读取的签名值和生成的相同瓦片的签名值，以确定两组签名值是否相同; 当两组签名值相同时，直接从瓦片帧缓冲区复制新瓦片而不呈现; 否则，用所生成的签名值更新所述签名值库，以代替所存储的签名值; 渲染瓷砖; 以及用新渲染的瓦片更新瓦片帧缓冲器。

公开(公告)号：US20170100810A1

公开(公告)日：2017-04-13

申请号：US14971438

申请日：2015-12-16

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Tsung-Ling HWANG ,  Chin-Te LIN ,  Shuo-Peng LIANG ,  Ta-Jen PENG ,  Jen-Ji WANG ,  Tzuo-Liang LUO

IPC: B23Q17/09 ,  G05B19/404

CPC classification number: B23Q17/0976 ,  G05B19/404 ,  G05B2219/31407 ,  G05B2219/41115 ,  G05B2219/41256 ,  G05B2219/49075

Abstract: A chatter avoidance method and device is provided, including steps of: providing a stable operating condition plot; partially removing a first layer of a workpiece with a predetermined first removal depth according to a safe removal depth of the stable operating condition plot and sensing a chatter caused by the removal operation; if no chatter is sensed, completing the removal operation, otherwise, continuing to partially remove the first layer with a second removal depth less than the predetermined first removal depth; and determining a minimum removal depth according to the removal operation, and removing a last layer of the workpiece with a last removal depth less than or equal to the minimum removal depth, allowing the workpiece to have a target thickness. The disclosure prevents a chatter from continuously occurring without requiring a shut-down and thereby maintains a desired production rate.