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公开(公告)号:US20230326421A1
公开(公告)日:2023-10-12
申请号:US18334510
申请日:2023-06-14
Applicant: INNOLUX CORPORATION
Inventor: Chung-Chun KUO , Chun-Fang CHEN , Hui-Wen SU , Wei-Yuan CHEN , Chung-Yu CHENG
CPC classification number: G09G3/3473 , G02B6/0068 , G02B6/4239
Abstract: A light-emitting assembly includes a substrate and a plurality of light-emitting elements disposed on the substrate. The substrate includes a base material layer, a first electrical conductive layer and a protection layer in a sectional view. A thickness of the first electrical conductive layer is greater than a thickness of the protection layer. The thickness of the protection layer is greater than 0 μm and less than 30 μm. This disclosure can improve the non-uniform brightness issue (hotspots) or enhance the optical performance.
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公开(公告)号:US20220172686A1
公开(公告)日:2022-06-02
申请号:US17667994
申请日:2022-02-09
Applicant: INNOLUX CORPORATION
Inventor: Chung-Chun KUO , CHUN-FANG CHEN , HUI-WEN SU , WEI-YUAN CHEN , CHUNG-YU CHENG
Abstract: A light-emitting assembly includes a substrate and a plurality of light-emitting elements. The substrate includes a component arrangement region and a planar region in a top view, and includes a base material layer, a filled layer and a protection layer in a sectional view. A thickness of the filled layer is greater than a thickness of the protection layer. The thickness of the protection layer is greater than 0 μm and less than 30 μm. The plurality of light-emitting elements are located on the component arrangement region. This disclosure can improve the non-uniform brightness issue (hotspots) or enhance the optical performance.
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