Image acquisition method for microbolometer thermal imaging systems

    公开(公告)号:US11368637B1

    公开(公告)日:2022-06-21

    申请号:US17177891

    申请日:2021-02-17

    Abstract: A method and system for imaging a target scene using a microbolometer array having multiple lines of microbolometer pixels are disclosed. Each line is switchable between an exposed state and a shielded state, where the line is exposed to the target scene and a reference scene, respectively. The method may include alternating between generating a target frame of the target scene and generating a reference frame of the reference scene, each of which in a rolling shutter mode. The method may also include, concurrently with the generating steps, alternating between sequentially shielding each line after its readout in the exposed state for its next readout in the shielded state, and sequentially exposing each line after its readout in the shielded state for its next readout in the exposed state. The method may also include adjusting the target frames using the reference frames to generate thermal images of the target scene.

    INFRARED SCENE PROJECTOR AND CONVERSION CHIP THEREFORE

    公开(公告)号:US20180113023A1

    公开(公告)日:2018-04-26

    申请号:US15333492

    申请日:2016-10-25

    Inventor: Bruno Tremblay

    CPC classification number: G01J5/0809 G01J5/522

    Abstract: The infrared scene projector has a support structure having an airtight chamber; an image projector secured to the support structure; a conversion chip having a substrate secured to the support structure, and an array of conversion units received on a face of the substrate, the array of conversion units being enclosed inside the airtight chamber and being optically coupled to the image projector, each one of the conversion units having at least one supporting post secured to the face of the substrate and a suspended platform held spaced apart from the face of the substrate by the at least one supporting post, the conversion chip being adapted to convert at least one of visible and near-infrared light received from the image projector into infrared radiation; and an infrared beam path extending away from the array of conversion units.

    Heat-loss pressure microsensors
    3.
    发明授权

    公开(公告)号:US11747231B2

    公开(公告)日:2023-09-05

    申请号:US17905813

    申请日:2020-04-08

    CPC classification number: G01L11/002 G01L27/002 G01K7/22

    Abstract: A heat-loss pressure microsensor for measuring a gas pressure is disclosed that includes a plurality of pressure gauges arranged proximate to one another on a substrate. The gauges may include a pair of gauges, each gauge including a thermistor having an electrical resistance that varies with its temperature, the thermistor's temperature being responsive to the gas pressure, a platform to receive the thermistor, and a support structure to hold the platform above the substrate. Each gauge may be configured to produce a gauge output signal related to the electrical resistance of its thermistor. The two gauges are configured with their platforms having equal nominal perimeters and different nominal surface areas, and their support structures having the same nominal geometry. A differential signal may be obtained from the two gauge output signals. The differential signal conveys information about the gas pressure and exhibits reduced sensitivity to fabrication-related dimensional variations.

    Infrared scene projector and conversion chip therefore

    公开(公告)号:US09952097B1

    公开(公告)日:2018-04-24

    申请号:US15333492

    申请日:2016-10-25

    Inventor: Bruno Tremblay

    CPC classification number: G01J5/0809 G01J5/522

    Abstract: The infrared scene projector has a support structure having an airtight chamber; an image projector secured to the support structure; a conversion chip having a substrate secured to the support structure, and an array of conversion units received on a face of the substrate, the array of conversion units being enclosed inside the airtight chamber and being optically coupled to the image projector, each one of the conversion units having at least one supporting post secured to the face of the substrate and a suspended platform held spaced apart from the face of the substrate by the at least one supporting post, the conversion chip being adapted to convert at least one of visible and near-infrared light received from the image projector into infrared radiation; and an infrared beam path extending away from the array of conversion units.

    Microbolometer detector with centrally-located support structure
    5.
    发明授权
    Microbolometer detector with centrally-located support structure 有权
    微量热计检测器,具有中心位置的支撑结构

    公开(公告)号:US08809786B2

    公开(公告)日:2014-08-19

    申请号:US13632577

    申请日:2012-10-01

    CPC classification number: G01J5/20 G01J5/023 G01J5/024 G01J2005/202

    Abstract: A microbolometer detector has an improved support structure. The microbolometer detector includes a substrate and a support structure including at least one post connected to and projecting substantially vertically from the substrate. The microbolometer detector also includes a platform held above the substrate and including a central region substantially vertically aligned with the at least one post of the support structure and a peripheral region surrounding the central region, the platform being supported by the support structure from the central region thereof. The microbolometer further includes at least one thermistor located in the peripheral region of the platform. A microbolometer focal plane array may also include multiple microbolometer detectors arranged in a two-dimensional array. The support structures are particularly well suited for supporting relatively large platforms of microbolometer detectors, particularly for far-infrared and terahertz detection and spectroscopy applications.

    Abstract translation: 微测热计检测器具有改进的支撑结构。 微测热计检测器包括基底和支撑结构,该支撑结构包括至少一个连接到基底上并基本垂直于基底垂直突出的柱。 该微热辐射热计检测器还包括一个平台,该平台保持在基板上方,并包括与支撑结构的至少一个支柱基本上垂直对准的中心区域和围绕该中心区域的周边区域,该平台由支撑结构从中心区域 其中。 微量热计还包括位于平台周边区域中的至少一个热敏电阻。 微测热计焦平面阵列还可以包括以二维阵列布置的多个微测热计检测器。 支撑结构特别适合于支持相对较大的微测辐射热探测器平台,特别是用于远红外和太赫兹检测和光谱学应用。

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