SYSTEM AND METHOD FOR PROVIDING HERMETICALLY SEALED PACKAGES WITH CONSISTENT VACUUM CAVITY

    公开(公告)号:US20170166442A1

    公开(公告)日:2017-06-15

    申请号:US14967007

    申请日:2015-12-11

    IPC分类号: B81C1/00 H01L21/52

    摘要: A method of forming a plurality of sealed packages comprises providing a base including a base surface; providing a lid including a lid surface; positioning a plurality of spaced apart seal members along the base surface, the seal members being formed from a seal material including a fusible metal alloy; positioning the lid on the base with a plurality of spaced apart spacers positioned and extending between the base surface and the lid surface, the spacers maintaining the lid surface spaced apart from the seal members by a fluid gap, the spacers being made from a spacer material including a fusible metal alloy; creating a controlled environment around the base and the lid; and heating to melt the spacers and the seal material so that the seal members form a plurality of seal rings between the base surface and the lid surface.

    SYSTEM AND METHOD FOR IMPROVING DICING QUALITY FOR BONDED WAFER PAIRS

    公开(公告)号:US20170170159A1

    公开(公告)日:2017-06-15

    申请号:US14967050

    申请日:2015-12-11

    IPC分类号: H01L25/00 H01L21/78

    CPC分类号: H01L25/50 H01L21/78

    摘要: A method for manufacturing a plurality of die pairs includes providing a first wafer including a plurality of spaced apart first dies arranged in a first array including a first, first die row and a second, first die row spaced apart by a first portion of a first row channel; providing a second wafer including a plurality of spaced apart second dies arranged in a second array including a first, second die row and a second, second die row spaced apart by a second portion of the first row channel; connecting the first wafer to the second wafer with a connector assembly to form a wafer pair such that the first dies and the second dies cooperate to form the plurality of die pairs; positioning a first support assembly between the first wafer and the second wafer to rigidly support the first wafer relative to the second wafer; and cutting along the first row channel with a blade to separate the plurality of die pairs from one another.