公开(公告)号：US20160276243A1

公开(公告)日：2016-09-22

申请号：US14767843

申请日：2014-09-27

Applicant: INTEL CORPORATION

Inventor： Jeffory L. SMALLEY ,  Susan F. SMITH ,  Mani PRAKASH ,  Tao LIU ,  Henry C. BOSAK ,  Almanzo T. ORTIZ

IPC: H01L23/367 ,  H01L25/065 ,  H01L23/433

CPC classification number: H01L23/3677 ,  H01L23/3675 ,  H01L23/4093 ,  H01L23/4338 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.

Abstract translation: 一种装置，包括主要装置和至少一个辅助装置，其以平面阵列耦合到基板; 第一被动式热交换器，其设置在所述主装置上并且在对应于所述至少一个次级装置的区域上具有开口; 设置在所述至少一个次级装置上的第二被动热交换器; 至少一个第一弹簧，其可操作以在所述主装置的方向上向所述第一热交换器施加力; 以及至少一个第二弹簧，其可操作以在所述次级装置的方向上向所述第二热交换器施加力。 一种方法，包括将被动热交换器放置在多芯片封装上，以及使弹簧偏转以在所述封装上的至少一个次级装置的方向施加力。

公开(公告)号：US20190067158A1

公开(公告)日：2019-02-28

申请号：US16175712

申请日：2018-10-30

Applicant: Intel Corporation

Inventor： Jeffory L. SMALLEY ,  Susan F. SMITH ,  Mani PRAKASH ,  Tao LIU ,  Henry C. BOSAK ,  Harvey R. KOFSTAD ,  Almanzo T. ORTIZ

IPC: H01L23/367 ,  H01L23/433 ,  H01L25/065 ,  H01L23/40

Abstract: An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.