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公开(公告)号：US20210202441A1
公开(公告)日：2021-07-01
申请号：US16070510
申请日：2016-02-05
Applicant: INTEL CORPORATION
Inventor： ENG HUAT GOH , CHU AUN LIM , UPENDRA R. SHETH , ROBERT STARKSTON
IPC: H01L25/065 , H01L23/00
Abstract: Various embodiments are generally directed to an electronic assembly comprising at least two dies stacked on top of each other. Metal columns of different heights electrically connect the dies to a system substrate.
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