公开(公告)号：US20190116660A1

公开(公告)日：2019-04-18

申请号：US16218344

申请日：2018-12-12

Applicant: INTEL CORPORATION

Inventor： Andrew MORNING-SMITH ,  Eugene LIM ,  Meng ZHAI

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K1/028 ,  H05K1/0278 ,  H05K1/189 ,  H05K3/4691 ,  H05K2201/055 ,  H05K2201/10159

Abstract: Embodiments include devices and method related to a foldable printed circuit board that may be used in SSD applications. One embodiment relates to a foldable printed circuit board comprising a first rigid portion, a second rigid portion, and a first flexible region coupling the first rigid portion to the second rigid portion. The foldable printed circuit board also includes a third rigid portion and a second flexible region coupling the second rigid portion to the third rigid portion, wherein the first rigid portion and the third rigid portion each have a width that is less than that of the second rigid portion. Other embodiments are described and claimed.