公开(公告)号：US20240365478A1

公开(公告)日：2024-10-31

申请号：US18769438

申请日：2024-07-11

申请人： BOE Technology Group Co., Ltd.

发明人： Guoteng LI ,  Shuilang DONG ,  Xinhong LU ,  Liuqing LI ,  Jingshang ZHOU ,  Baoman LI ,  Zhao CUI ,  Yingwei LIU

IPC分类号： H05K3/46 ,  H05K1/11 ,  H05K3/16 ,  H05K3/40 ,  H05K5/00

CPC分类号： H05K3/4691 ,  H05K1/111 ,  H05K3/16 ,  H05K3/4007 ,  H05K5/0069 ,  H05K2203/0143 ,  H05K2203/0723 ,  H05K2203/1377

摘要： Embodiments of the present disclosure provide a circuit board, a display apparatus, and a manufacturing method for a circuit board. The manufacturing method for the circuit board includes: providing a precursor substrate; forming seed patterns and an auxiliary seed pattern on a side of the precursor substrate, where the seed patterns are located in the patterned areas, the auxiliary seed pattern is located in the non-patterned area, and the seed pattern and the auxiliary seed pattern are separated from each other; and forming a pad at a position of the seed pattern and an auxiliary pattern at a position of the auxiliary seed pattern by an electroplating process.

公开(公告)号：US12108524B2

公开(公告)日：2024-10-01

申请号：US17532105

申请日：2021-11-22

申请人： MURATA MANUFACTURING CO., LTD.

发明人： Toshikazu Harada

IPC分类号： H05K1/02 ,  H05K3/00 ,  H05K3/46

CPC分类号： H05K1/028 ,  H05K1/024 ,  H05K1/0271 ,  H05K1/0278 ,  H05K3/0044 ,  H05K3/4617 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0191 ,  H05K2203/068

摘要： A printed board includes a laminate in which insulating base members formed of the same material are laminated with conductor patterns. The printed board includes a bent part that is thinner than first and second substrate portions. A first main surface is located on an inner peripheral side and a second main surface is located on an outer peripheral side of the printed board. The first and second substrate portions each include an outermost insulating base member connected to an outermost insulating base member of the bent portion. The bent part includes a first conductor pattern closer to the first main surface and a second conductor pattern closer to the second main surface. A distance from the first conductor pattern to the first main surface is greater than a distance from the second conductor pattern to the second main surface. No interlayer connection conductors are located in the bent part.

公开(公告)号：US20240049401A1

公开(公告)日：2024-02-08

申请号：US18364013

申请日：2023-08-02

申请人： TRIPOD (WUXI) ELECTRONIC CO., LTD.

发明人： Cheng Ming LU ,  Han-Ching SHIH ,  Hsu TU ,  Wen-Che CHEN ,  Wu-Chiang MA

IPC分类号： H05K3/46 ,  H05K1/18

CPC分类号： H05K3/4691 ,  H05K1/182

摘要： A semi-flex printed circuit board with cover-opening opening is disclosed. An inner side of the core substrate surrounds a cover-opening opening. The two metal dam structures are arranged on a side surface of the core substrate; and the two metal dam structures and the core substrate jointly surround the cover-opening opening. The core board is arranged on a side surface of the bonding sheet away from the core substrate. Two sides of a bottom of the core substrate surrounding the cover-opening opening are provided with two laser cutting sidewalls respectively. Sidewalls of the two metal dam structures surrounding the cover-opening opening are connected with the two laser cutting sidewalls respectively and each defined as a metal dam sidewall. An obtuse angle presents between the metal dam sidewall and the laser cutting sidewall.

公开(公告)号：US20230335466A1

公开(公告)日：2023-10-19

申请号：US18337438

申请日：2023-06-20

申请人： Unimicron Technology Corp.

发明人： Chin-Sheng Wang ,  Ra-Min Tain ,  Chih-Kai Chan ,  Jun-Ho Chen

IPC分类号： H01L23/48 ,  H01L23/66 ,  H05K1/18 ,  H05K3/46 ,  H05K1/02

CPC分类号： H01L23/481 ,  H01L23/66 ,  H05K1/189 ,  H05K3/4691 ,  H05K3/4697 ,  H05K1/0216 ,  H01L2223/6677 ,  H05K2201/10098 ,  H05K2201/0154 ,  H05K2201/09809

摘要： An electronic packaging structure including a first circuit structure, a second circuit structure and at least one electronic device is provided. The bottom side of the first circuit structure has at least one cavity. The first circuit structure is disposed on the second circuit structure. The first circuit structure and the second circuit structure are electrically connected to each other. The electronic device is disposed on the second circuit structure. The electronic device is disposed corresponding to the cavity of the first circuit structure.

公开(公告)号：US20230231294A1

公开(公告)日：2023-07-20

申请号：US18125271

申请日：2023-03-23

申请人： DONGWOO FINE-CHEM CO., LTD.

发明人： Young Ju KIM ,  Dong Pil PARK ,  Byung Jin CHOI ,  Na Yeon KIM ,  Han Sub RYU

IPC分类号： H01Q1/22 ,  H04M1/02 ,  H01Q1/38 ,  H05K3/46

CPC分类号： H01Q1/2266 ,  H01Q1/38 ,  H01Q1/2283 ,  H04M1/0277 ,  H05K3/4691 ,  H05K1/0216

摘要： An antenna package includes a first antenna device including a first antenna unit, a second antenna device disposed at a level different from that of the first antenna device, the second antenna device including a second antenna unit that has a radiation direction different from that of the first antenna unit, a first circuit board electrically connected to the first antenna unit, a second circuit board electrically connected to the second antenna unit, and a third circuit board electrically and independently connected to the first circuit board and the second circuit board, the third circuit board having at least one antenna driving integrated circuit (IC) chip mounted thereon.

公开(公告)号：US20230164928A1

公开(公告)日：2023-05-25

申请号：US17945106

申请日：2022-09-15

申请人： Unimicron Technology Corp.

发明人： Cheng-Ta Ko ,  Pu-Ju Lin ,  Shih-Chieh Chen ,  Chi-Hai Kuo ,  Jeng-Ting Li

IPC分类号： H05K3/46 ,  H05K1/03 ,  H05K1/11 ,  H05K3/06

CPC分类号： H05K3/4691 ,  H05K1/0393 ,  H05K1/118 ,  H05K3/06 ,  H05K2201/0154 ,  H05K2201/09509

摘要： A flexible circuit board and a manufacturing method thereof are provided. The flexible circuit board includes a circuit structure, a first cover layer, and a second cover layer. The circuit structure has a top surface and a bottom surface opposite to the top surface. The circuit structure includes multiple circuit layers and multiple insulating layers stacked alternately. A material of the insulating layers is a photosensitive dielectric material and a Young's modulus of the insulating layers is between 0.36 GPa and 8 GPa. The first cover layer is disposed on the top surface of the circuit structure. The second cover layer is disposed on the bottom surface of the circuit structure.

公开(公告)号：US20180332722A1

公开(公告)日：2018-11-15

申请号：US15748999

申请日：2016-07-27

申请人： LG INNOTEK CO., LTD.

发明人： HYUN WOO RYOU

IPC分类号： H05K3/46 ,  H04N5/225

CPC分类号： H05K3/4691 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H05K1/0281 ,  H05K1/144 ,  H05K1/147 ,  H05K3/365 ,  H05K2201/056 ,  H05K2201/09163 ,  H05K2201/10121

摘要： The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to prevent interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.

公开(公告)号：US20180192516A1

公开(公告)日：2018-07-05

申请号：US15581947

申请日：2017-04-28

申请人： HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd. ,  FuKui Precision Component (Shenzhen) Co., Ltd.

发明人： XIAN-QIN HU ,  MEI YANG ,  CHENG-JIA LI

IPC分类号： H05K1/11 ,  H05K3/46 ,  H05K3/18 ,  H05K3/00 ,  H05K3/40

CPC分类号： H05K1/115 ,  H05K3/0023 ,  H05K3/18 ,  H05K3/185 ,  H05K3/4076 ,  H05K3/429 ,  H05K3/4644 ,  H05K3/4661 ,  H05K3/4691 ,  H05K2201/096 ,  H05K2203/0703

摘要： A composite circuit board includes an insulation layer, an inner circuit layer, a first conductive layer and a second conductive layer embedded in the insulation layer, a third conductive layer and a fourth conductive layer formed on opposite surfaces of the insulation layer. The third conductive layer electrically connects with the first conductive layer. The fourth conductive layer electrically connects with the second conductive layer. The inner circuit layer is in a middle portion of the insulation layer. The first conductive layer and the second conductive layer respectively forms on opposite sides of the inner circuit layer. The insulation layer forms a plurality of first through holes between the first conductive layer and the inner circuit layer, a plurality of second through holes between the second conductive layer and the inner circuit layer.

公开(公告)号：US09980380B2

公开(公告)日：2018-05-22

申请号：US15331987

申请日：2016-10-24

申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

发明人： Rainer Pludra ,  Dietmar Drofenik ,  Johannes Stahr ,  Siegfried Götzinger ,  Ljubomir Mareljic

IPC分类号： H05K1/00 ,  H05K1/14 ,  H05K1/18 ,  H05K3/36 ,  H05K3/46 ,  H05K1/11 ,  H05K3/22

CPC分类号： H05K1/142 ,  H05K1/115 ,  H05K1/185 ,  H05K1/189 ,  H05K3/225 ,  H05K3/368 ,  H05K3/4691 ,  H05K3/4694 ,  H05K2201/0187 ,  H05K2201/09163 ,  H05K2201/09845 ,  H05K2203/1461 ,  Y10T29/49155

摘要： In a method for producing a printed circuit board consisting of at least two printed circuit regions, wherein the printed circuit board regions each compromise at least one conductive layer and/or at least one device or once conductive component, wherein printed circuit board regions to be connected to another one, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a coupling or connection, and wherein, after a coupling or connection of printed circuit board regions, at least one additional layer or ply of the printed circuit board is applied over the printed circuit board regions, the additional layer is embodied as a conductive layer, which is contact-connected via plated-through holes to conductive layers or devices or components integrated in the printed circuit board regions.

公开(公告)号：US09949382B2

公开(公告)日：2018-04-17

申请号：US14801929

申请日：2015-07-17

申请人： Murata Manufacturing Co., Ltd.

发明人： Shunsuke Chisaka

IPC分类号： H05K3/46

CPC分类号： H05K3/4691 ,  H05K2201/0129 ,  H05K2201/09127 ,  H05K2203/0228 ,  Y10T29/49155 ,  Y10T156/1052

摘要： A method for manufacturing a rigid-flexible multilayer wiring board includes a step of forming a release layer such that the release layer covers a flexible portion forming region of a principal surface of a first thermoplastic resin sheet, a step of conducting surface modification on the principal surface of the first thermoplastic resin sheet while using the release layer as a mask, a step of laminating a second thermoplastic resin sheet such that the second thermoplastic resin sheet covers the release layer to form a laminate including the first and second thermoplastic resin sheets, a step of press-bonding the laminate, a step of forming a cut from at least either one of upper and lower surfaces of the laminate toward an outline of the release layer when seen in a plan view, and a step of removing a portion surrounded by the cut.