公开(公告)号：US20230163045A1

公开(公告)日：2023-05-25

申请号：US17919730

申请日：2020-05-19

Applicant: INTEL CORPORATION

Inventor： Bin LIU ,  Fen YI

IPC: H01L23/373 ,  H01L23/00 ,  H01L25/065 ,  H01L21/48

CPC classification number: H01L23/3737 ,  H01L24/32 ,  H01L24/33 ,  H01L25/0657 ,  H01L25/0655 ,  H01L21/481 ,  H01L2224/32225 ,  H01L24/48 ,  H01L2224/48105 ,  H01L2224/48145 ,  H01L2224/48225 ,  H01L24/73 ,  H01L2224/73265 ,  H01L2224/33181 ,  H01L2224/32145 ,  H01L2224/73215 ,  H01L2225/06562 ,  H01L23/49827

Abstract: Embodiments of the present disclosure are directed to organic spacers for integrated circuits. Among other things, the organic spacers of the embodiments of the present disclosure help provide a cost-efficient and effective solution to address issues such as coefficient of thermal expansion (CTE) mismatches, dynamic warpage, and solder joint reliability (SJR). Other embodiments may be described and claimed.