公开(公告)号：US20180068926A1

公开(公告)日：2018-03-08

申请号：US15553932

申请日：2015-03-27

Applicant: INTEL CORPORATION

Inventor： JAN KRAJNIAK ,  TANNAZ HARIRCHIAN ,  KELLY P. LOFGREEN ,  JAMES C. MATAYABAS, Jr. ,  NACHIKET R. RARAVIKAR ,  ROBERT L. SANKMAN

IPC: H01L23/427 ,  H01L23/373 ,  H01L21/77

Abstract: Embodiments of the present disclosure describe an energy storage material for thermal management and associated techniques and configurations. In one embodiment, an energy storage material may include an organic matrix and a solid-solid phase change material dispersed in the organic matrix, the solid-solid phase change material to change crystalline structure and absorb heat while remaining a solid at a threshold temperature associated with operation of an integrated circuit (IC) die. Other embodiments may be described and/or claimed.