公开(公告)号：US20220139843A1

公开(公告)日：2022-05-05

申请号：US17428565

申请日：2019-04-10

Applicant: INTEL CORPORATION

Inventor： Jun LU ,  Wei LIAO ,  Chen ZHANG ,  Guangying ZHANG ,  Liguang DU ,  Chuansheng LIU ,  Michael LEDDIGE ,  Weimin SHI ,  Eduardo MICHEL ,  Guillermo RENTERIA ZAMUDIO

IPC: H01L23/552 ,  H01L23/00

Abstract: An integrated circuit assembly may be formed having at least one integrated circuit device electrically attached to an electronic substrate. The integrated circuit assembly may further include at least one electromagnetic interference structure attached to the electronic substrate adjacent to the at least one integrated circuit device. The at least one electromagnetic interference structure may be electrically attached to the electronic substrate with at least one resilient connector extending therebetween. In one embodiment, the at least one electromagnetic interference structure may be grounded to the electronic substrate.