INTEGRATED ASSEMBLY FOR INSTALLING INTEGRATED CIRCUIT DEVICES ON A SUBSTRATE
    1.
    发明申请
    INTEGRATED ASSEMBLY FOR INSTALLING INTEGRATED CIRCUIT DEVICES ON A SUBSTRATE 审中-公开
    用于在基板上安装集成电路设备的集成组件

    公开(公告)号:US20160105974A1

    公开(公告)日:2016-04-14

    申请号:US14975352

    申请日:2015-12-18

    Abstract: In one embodiment, a biasing device is actuated using an actuator which is aligned with the biasing device along an alignment axis. A first frame is thereby biased toward a second frame along the alignment axis to bias an integrated circuit package toward a socket. The actuator also latches the first and second frames together and biased towards each other with the integrated circuit package and the socket biased toward each other. Other aspects and features are also described.

    Abstract translation: 在一个实施例中,使用致动器致动偏置装置,所述致动器沿着对准轴与偏压装置对准。 因此,第一框架沿着对准轴偏向第二框架,以将集成电路封装朝向插座偏置。 致动器还将第一和第二框架锁定在一起并且通过集成电路封装件相对于彼此偏置并且插座朝向彼此偏置。 还描述了其他方面和特征。

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