公开(公告)号：US20160377658A1

公开(公告)日：2016-12-29

申请号：US14748976

申请日：2015-06-24

Applicant: INTEL CORPORATION

Inventor： Paul J. DIGLIO ,  John C. JOHNSON ,  Weihua TANG

IPC: G01R1/44 ,  G01R31/26

CPC classification number: G01R31/2874

Abstract: Improved fluid flow is described for a temperature control actuator that is used in semiconductor device test. In one example, the apparatus includes a top plate configured to thermally connect to a semiconductor device under test, a channel plate thermally connected to the top plate and having a plurality of fluid channels to receive a thermally controlled fluid from an inlet to exchange heat with the thermally controlled fluid in the channel and to eliminate the thermally controlled fluid to an outlet, a manifold to provide the thermally controlled fluid to the inlet and to receive the thermally controlled fluid through the outlet, and a flow guide in the channel thermally connected to the top plate.

Abstract translation: 对用于半导体器件测试的温度控制致动器描述了改进的流体流动。 在一个示例中，该装置包括被配置为热连接到被测半导体器件的顶板，热连接到顶板的通道板，并且具有多个流体通道，用于从入口接收热控流体以与 通道中的热控制流体并且将热控流体消除到出口，歧管以将热控流体提供到入口并且通过出口接收热控流体，以及通道中的流动引导件热连接到 顶板。