公开(公告)号：US12003023B2

公开(公告)日：2024-06-04

申请号：US16258573

申请日：2019-01-26

申请人： INTEL CORPORATION

发明人： Zhenguo Jiang ,  Omkar Karhade ,  Srichaitra Chavali ,  Zhichao Zhang ,  Jimin Yao ,  Stephen Smith ,  Xiaoqian Li ,  Robert Sankman

IPC分类号： H01Q1/22 ,  H01L21/56 ,  H01L23/00 ,  H01Q1/38

CPC分类号： H01Q1/38 ,  H01L21/56 ,  H01L24/26 ,  H01Q1/2283 ,  H05K2201/10098

摘要： An RF chip package comprises a housing and one or more conductive contacts designed to electrically connect the RF chip package to other conductive contacts. The housing includes a first substrate, a 3-D antenna on the first substrate, and a second substrate. The second substrate includes a plurality of semiconductor devices and is bonded to the first substrate. An interconnect structure allows for electrical connection between the first and second substrates. In some cases, the first substrate is flip-chip bonded to the second substrate or is otherwise connected to the second substrate by an array of solder balls. By integrating both the 3-D antenna and RF circuitry together in the same chip package, costs are minimized while bandwidth is greatly improved compared to a separately machined 3-D antenna.