公开(公告)号：US20150334867A1

公开(公告)日：2015-11-19

申请号：US14236583

申请日：2014-01-15

Applicant: INTEL CORPORATION

Inventor： Donald L. FAW ,  Uri V. CUMMINGS ,  Terrence J. TRAUSCH ,  Daniel P. DALY ,  Andrew C. ALDUINO

IPC: H05K7/14

CPC classification number: G02B6/4452 ,  G02B6/3897 ,  G06F1/183 ,  H04Q1/09 ,  H04Q1/13 ,  H05K7/1487 ,  H05K7/1489 ,  H05K7/1492 ,  Y10T29/49906

Abstract: Embodiments of the present disclosure provide techniques and configurations for a rack assembly. In one embodiment, a tray to be disposed in a rack assembly may comprise a plurality of sleds with individual sleds including one or more compute nodes; and a networking element coupled with a sled of the plurality of sleds and configured to communicatively connect the sled to one or more other components of the rack assembly via an optical communication system. The optical communication system may include an external optical cable configured to communicatively connect the networking element with the rack assembly. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例提供了用于机架组件的技术和配置。 在一个实施例中，要布置在机架组件中的托盘可以包括具有单个滑架的多个滑架，包括一个或多个计算节点; 以及网络元件，其与所述多个滑板的滑板相耦合，并且被配置为经由光通信系统将所述滑板可通信地连接到所述齿条组件的一个或多个其它部件。 光通信系统可以包括被配置为将网络元件与机架组件通信地连接的外部光缆。 可以描述和/或要求保护其他实施例。

公开(公告)号：US20210117249A1

公开(公告)日：2021-04-22

申请号：US17134324

申请日：2020-12-26

Applicant: Intel Corporation

Inventor： Kshitij A. DOSHI ,  Johan VAN DE GROENENDAAL ,  Edmund CHEN ,  Ravi SAHITA ,  Andrew J. HERDRICH ,  Debra BERNSTEIN ,  Christine E. SEVERNS-WILLIAMS ,  Uri V. CUMMINGS ,  Utkarsh Y. KAKAIYA

IPC: G06F9/52 ,  H04L29/08

Abstract: Examples described herein relate to an Infrastructure Processing Unit (IPU) that comprises: interface circuitry to provide a communicative coupling with a platform; network interface circuitry to provide a communicative coupling with a network medium; and circuitry to expose infrastructure services to be accessed by microservices for function composition and to selectively provide a barrier to halt operation of at least one microservice based on event data from a composite node that performs the at least one microservice.

公开(公告)号：US20210117242A1

公开(公告)日：2021-04-22

申请号：US17134321

申请日：2020-12-26

Applicant: Intel Corporation

Inventor： Johan VAN DE GROENENDAAL ,  Kshitij A. DOSHI ,  Edmund CHEN ,  Ravi SAHITA ,  Andrew J. HERDRICH ,  Debra BERNSTEIN ,  Christine E. SEVERNS-WILLIAMS ,  Uri V. CUMMINGS ,  Utkarsh Y. KAKAIYA

IPC: G06F9/50 ,  H04L29/08 ,  G06F9/54 ,  H04L12/26

Abstract: Examples described herein relate to an Infrastructure Processing Unit (IPU) that comprises: interface circuitry to provide a communicative coupling with a platform; network interface circuitry to provide a communicative coupling with a network medium; and circuitry to expose infrastructure services to be accessed by microservices for function composition.

公开(公告)号：US20230176934A1

公开(公告)日：2023-06-08

申请号：US18090373

申请日：2022-12-28

Applicant: Intel Corporation

Inventor： Robert SOULE ,  Rajit MANOHAR ,  Jr-Shian TSAI ,  Edmund CHEN ,  Uri V. CUMMINGS ,  Pietro BRESSANA ,  Rui LI

IPC: G06F9/54

CPC classification number: G06F9/547 ,  G06F9/544

Abstract: Examples described herein relate to a network interface device that includes packet processing circuitry and circuitry. In some examples, the circuitry is to execute a first process to provide a remote procedure call (RPC) interface for a second process. In some examples, the second process comprises a business logic. In some examples, resource and deployment definitions of the first and second processes are based on an Interface Description Language (IDL) and a memory allocation. In some examples, the memory allocation among the processes provides share at least one RPC message as at least one formatted object accessible from memory.

公开(公告)号：US20230161652A1

公开(公告)日：2023-05-25

申请号：US18090356

申请日：2022-12-28

Applicant: Intel Corporation

Inventor： Robert SOULE ,  Rajit MANOHAR ,  Jr-Shian TSAI ,  Edmund CHEN ,  Uri V. CUMMINGS ,  Pietro BRESSANA ,  Rui LI

IPC: G06F9/54

CPC classification number: G06F9/547 ,  G06F9/544

Abstract: Examples described herein relate to a network interface device that includes packet processing circuitry and circuitry. In some examples, the circuitry is to execute a first process of partitioned processes to provide a remote procedure call (RPC) interface for a second process. In some examples, the second process of the partitioned processes includes a business logic. In some examples, the partitioned processes comprise resource and deployment definition are based on an Interface Description Language (IDL) and a memory allocation.

公开(公告)号：US20170102510A1

公开(公告)日：2017-04-13

申请号：US15378786

申请日：2016-12-14

Applicant: Intel Corporation

Inventor： Donald L. FAW ,  Uri V. CUMMINGS ,  Terrence J. TRAUSCH ,  Daniel P. DALY ,  Andrew C. ALDUINO

IPC: G02B6/44 ,  G02B6/38 ,  H04Q1/02 ,  H05K7/14

CPC classification number: G02B6/4452 ,  G02B6/3897 ,  G06F1/183 ,  H04Q1/09 ,  H04Q1/13 ,  H05K7/1487 ,  H05K7/1489 ,  H05K7/1492 ,  Y10T29/49906

Abstract: Embodiments of the present disclosure provide techniques and configurations for a rack assembly. In one embodiment, a tray to be disposed in a rack assembly may comprise a plurality of sleds with individual sleds including one or more compute nodes; and a networking element coupled with a sled of the plurality of sleds and configured to communicatively connect the sled to one or more other components of the rack assembly via an optical communication system. The optical communication system may include an external optical cable configured to communicatively connect the networking element with the rack assembly. Other embodiments may be described and/or claimed.