公开(公告)号：US11922152B2

公开(公告)日：2024-03-05

申请号：US17430394

申请日：2019-02-26

Applicant: INTEL CORPORATION

Inventor： Yuan Chen

IPC: G06F8/41 ,  G06F9/50

CPC classification number: G06F8/4441 ,  G06F8/42 ,  G06F8/4434 ,  G06F9/505

Abstract: An embodiment of a semiconductor package apparatus may include technology to identify workload control variables, add workload flags to respective edges in a static single assignment graph, and propagate constants based on the identified workload control variables and the workload flags. Other embodiments are disclosed and claimed.

公开(公告)号：US20230168898A1

公开(公告)日：2023-06-01

申请号：US18159666

申请日：2023-01-25

Applicant: Intel Corporation

Inventor： Yuan Chen ,  Junyong Ding ,  Mohammad Haghighat

IPC: G06F9/38

CPC classification number: G06F9/3885 ,  G06F9/3851

Abstract: Methods, apparatus, systems, and articles of manufacture to schedule parallel instructions using hybrid cores are disclosed. An example apparatus includes thread processing circuitry to split a first thread of the parallel threads into partitions; scheduling circuitry to: select (a) a first core to execute a first partition of the partitions and (b) a second core different than the first core to execute a second partition of the partitions; and generate an execution schedule based on the selection, the interface circuitry to transmit the execution schedule to a device that schedules instructions on the first and second core.

公开(公告)号：US20220147331A1

公开(公告)日：2022-05-12

申请号：US17430394

申请日：2019-02-26

Applicant: INTEL CORPORATION

Inventor： Yuan Chen

IPC: G06F8/41 ,  G06F9/50

Abstract: An embodiment of a semiconductor package apparatus may include technology to identify workload control variables, add workload flags to respective edges in a static single assignment graph, and propagate constants based on the identified workload control variables and the workload flags. Other embodiments are disclosed and claimed.