公开(公告)号：US20230085201A1

公开(公告)日：2023-03-16

申请号：US17802117

申请日：2020-03-30

Applicant: INTEL CORPORATION

Inventor： Keqiang WU ,  Zhidong YU ,  Cheng XU ,  Samuel ORTIZ ,  Weiting CHEN

IPC: G06F13/16 ,  G06F13/40

Abstract: The present disclosure provides an interconnect for a non-uniform memory architecture platform to provide remote access where data can dynamically and adaptively be compressed and decompressed at the interconnect link. A requesting interconnect link can add a delay to before transmitting requested data onto an interconnect bus, compress the data before transmission, or packetize and compress data before transmission. Likewise, a remote interconnect link can decompress request data.