公开(公告)号：US20130149075A1

公开(公告)日：2013-06-13

申请号：US13708751

申请日：2012-12-07

申请人： INTEVAC, INC.

发明人： Vinay Shah ,  William Runstadler, JR. ,  Kevin P. Fairbairn ,  Terry Bluck ,  Richard Henry Cooke

IPC分类号： H01L21/677

CPC分类号： H01L21/67736 ,  H01L21/67126 ,  H01L21/67201 ,  H01L21/67271 ,  H01L21/67288

摘要： A system for transporting substrates from an atmospheric pressure to high vacuum pressure and comprising: a rough vacuum chamber having an entry valve and an exit opening; a high vacuum chamber having an entry opening, the high vacuum chamber coupled to the rough vacuum chamber such that the exit opening and the entry opening are aligned; a valve situated between the exit opening and the entry opening; a first conveyor belt provided in the rough vacuum chamber; a second conveyor provided in the high vacuum chamber; a sensing element provided in the high vacuum chamber to enable detection of broken substrates on the second conveyor; and, a mechanism provided on the second conveyor belt enabling dumping of broken substrates onto the bottom of the high vacuum chamber.

摘要翻译： 一种用于将基板从大气压输送到高真空压力的系统，包括：具有入口阀和出口的粗真空室; 具有进入开口的高真空室，所述高真空室联接到所述粗真空室，使得所述出口和入口开口对齐; 位于出口和入口之间的阀; 设置在粗糙真空室中的第一传送带; 设置在高真空室中的第二传送器; 设置在所述高真空室中以便能够检测所述第二输送机上的破裂的基板的感测元件; 以及设置在第二传送带上的机构，其能够将破碎的基板倾倒到高真空室的底部上。