公开(公告)号：US20220184865A1

公开(公告)日：2022-06-16

申请号：US17173390

申请日：2021-02-11

Applicant: INTOPS CO., LTD.

Inventor： Tae yong HONG ,  Jun young AHN

IPC: B29C45/14

Abstract: An in-mold electronic structure according to the present invention comprises a film with a design; a first plastic resin disposed under the film, and a second plastic resin disposed under the first plastic resin, wherein an electronic circuit is formed on a top side or both sides of the second plastic resin, wherein an electronic device is mounted on the top side or the both sides of the second plastic resin, wherein the film, the first plastic resin, and the second resin with the electronic circuit and the electronic device, are integrated.