公开(公告)号：US20220209401A1

公开(公告)日：2022-06-30

申请号：US17179664

申请日：2021-02-19

Applicant: INTOPS CO., LTD.

Inventor： Tae yong HONG ,  Gyeom son SEONG

IPC: H01Q1/42 ,  B29C45/14 ,  B29C45/00 ,  B29C65/48 ,  B41M3/00 ,  H05B3/84 ,  B60R19/52 ,  B60Q1/24

Abstract: A method for a radome structure having a heating and a light emitting function according to the present invention comprises forming a three dimensional shape with a film part comprising a film, and a light emitting circuit and a heating circuit printed on the film in a stack; cutting the film part, and integrating an upper cover, a lower cover, and the film part disposed between the upper and the lower cover, into one body using one of a bonding process or an injection-molding process.

公开(公告)号：US20220184865A1

公开(公告)日：2022-06-16

申请号：US17173390

申请日：2021-02-11

Applicant: INTOPS CO., LTD.

Inventor： Tae yong HONG ,  Jun young AHN

IPC: B29C45/14

Abstract: An in-mold electronic structure according to the present invention comprises a film with a design; a first plastic resin disposed under the film, and a second plastic resin disposed under the first plastic resin, wherein an electronic circuit is formed on a top side or both sides of the second plastic resin, wherein an electronic device is mounted on the top side or the both sides of the second plastic resin, wherein the film, the first plastic resin, and the second resin with the electronic circuit and the electronic device, are integrated.

公开(公告)号：US20230020151A1

公开(公告)日：2023-01-19

申请号：US17399120

申请日：2021-08-11

Applicant: INTOPS CO., LTD.

Inventor： sung-hoon Jung ,  Tae yong HONG

IPC: H05K1/02 ,  H05K3/18 ,  H05K3/00

Abstract: Disclosed herein is an in-mold electronics (IME) structure. The IME structure includes a film, a first plastic resin positioned under the film, and a second plastic resin positioned under the first plastic resin. An electronic circuit is formed on a top or bottom surface of the second plastic resin by a plating method and also electronic elements are mounted thereon. The electronic elements include LED light sources, a plurality of protruding light guides configured to guide lighting through distribution and direction is formed on the top surface of the second plastic resin, and the LED light sources are installed in respective spaces provided by the light guides.