Abstract:
A method and system for improved material processing using a laser beam. The method and system includes directing a laser beam above, at or below the surface of the material in one or more preferred patterns and with preferred laser pulse characteristics specific to the material to reduce or mitigate the accumulation or effects of gas, debris, fluid, or other by-products of photodisruption either at the location where additional laser pulses are being placed or in other sensitive locations in the material.
Abstract:
A closed-loop focusing system and method positions a focusing assembly to a desired positioned. A feedback positioning device, such as a linear encoder, provides an actual or nullreadnull value for the linear movement of the focusing assembly. The desired position is compared to the actual position of the focusing assembly. If the two values are outside of a predetermined tolerance or valid range, then an audible or visual warning will be given. When a laser source is utilized with the focusing system, laser operation will be prevented if the two values are outside of an acceptable range. However, if the difference between the desired position and the actual position are within an acceptable range, the focusing assembly is repositioned to allow real-time systematic correction of the position of the focusing assembly.