公开(公告)号：US20230240022A1

公开(公告)日：2023-07-27

申请号：US17649100

申请日：2022-01-27

Applicant: IO Tech Group Ltd.

Inventor： Ralph S. Birnbaum ,  Guy Nesher ,  Alexander Slavomir Stepinski ,  Michael Zenou

IPC: H05K3/46 ,  C23C14/28 ,  B23K26/342

CPC classification number: H05K3/4664 ,  C23C14/28 ,  B23K26/342 ,  H05K3/4682 ,  H05K2203/107 ,  H05K2203/1131 ,  H05K2203/1492 ,  B23K2101/42

Abstract: Systems and methods for printing a printed circuit board (PCB) from substrate to full integration utilize a laser-assisted deposition (LAD) system to print a flowable material on top of a substrate by laser jetting to create a PCB structure to be used as an electronic device. One such system for PCB printing includes a jet printing unit, an imaging unit, curing units, and a drilling unit to print metals and other materials (e.g., epoxies, solder masks, etc.) directly on a PCB substrate such as a glass-reinforced epoxy laminate material (e.g., FR4). The jet printing unit can also be used for sintering and/or ablating materials. Printed materials are cured by heat or by infrared (IR) or ultraviolet (UV) radiation. PCBs produced according to the present systems and methods may be single-sided or double-sided.