公开(公告)号：US20230220541A1

公开(公告)日：2023-07-13

申请号：US18000789

申请日：2021-06-04

Applicant: IONICS SA

Inventor： Fabien MONTEVERDE ,  Thomas GODFROID ,  Luc LANGER ,  Fabian RENAUX

IPC: C23C14/48 ,  H01R13/03 ,  C23C14/16 ,  C22C5/02

CPC classification number: C23C14/48 ,  H01R13/03 ,  C23C14/16 ,  C22C5/02

Abstract: The current invention relates to a gold nickel layer comprising nitrogen inserted over a thickness equal to or greater than 0.20 μm, characterized in that the atomic concentration of gold is at least 15% over said thickness, the atomic concentration of nickel is at least 10% over said thickness and the atomic concentration of nitrogen is at least 5% over said thickness. The invention further relates to a process for treating a gold nickel layer. The invention also relates to a connector comprising a portion of a surface which comprises such a gold nickel layer.