公开(公告)号：US20240336994A1

公开(公告)日：2024-10-10

申请号：US18747526

申请日：2024-06-19

Applicant: HRL Laboratories, LLC

Inventor： John H. MARTIN ,  Julie MILLER ,  Brennan D. YAHATA ,  Jacob M. HUNDLEY

IPC: C22C9/00 ,  B22F9/02 ,  B23K26/342 ,  B33Y10/00 ,  B33Y70/00 ,  C22C5/02 ,  C22C5/06 ,  C22C11/00 ,  C22C12/00 ,  C22C13/00 ,  C22C14/00 ,  C22C16/00 ,  C22C18/00 ,  C22C19/03 ,  C22C19/07 ,  C22C21/00 ,  C22C22/00 ,  C22C27/00 ,  C22C27/02 ,  C22C27/04 ,  C22C27/06 ,  C22C28/00 ,  C22C38/00 ,  C22C49/14

CPC classification number: C22C9/00 ,  B22F9/02 ,  B23K26/342 ,  B33Y70/00 ,  C22C5/02 ,  C22C5/06 ,  C22C11/00 ,  C22C12/00 ,  C22C13/00 ,  C22C14/00 ,  C22C16/00 ,  C22C18/00 ,  C22C19/03 ,  C22C19/07 ,  C22C21/00 ,  C22C22/00 ,  C22C27/00 ,  C22C27/02 ,  C22C27/04 ,  C22C27/06 ,  C22C28/00 ,  C22C38/00 ,  C22C49/14 ,  B22F2304/10 ,  B33Y10/00

Abstract: Some variations provide a metal-alloy biphasic system containing a first metal M1 and a second metal M2, wherein a second metal phase has a melting temperature lower than that of a first metal phase, and wherein the metal-alloy biphasic system has a hierarchical microstructure containing a second length scale that is at least one order of magnitude smaller than a first length scale. Some variations provide a metal-alloy biphasic system containing a first metal M1 and a second metal M2, wherein a second metal phase has a melting temperature lower than that of a first metal phase, and wherein the first metal phase forms a continuous network. Other variations provide a metal-alloy biphasic powder containing at least a first metal and a second metal, wherein the solubility of first metal in second metal is less than 5%. Methods of making and using the powders and biphasic system are disclosed.

公开(公告)号：US12104236B2

公开(公告)日：2024-10-01

申请号：US16968764

申请日：2019-02-28

Applicant: TOKYO INSTITUTE OF TECHNOLOGY ,  TANAKA KIKINZOKU KOGYO K.K.

Inventor： Hideki Hosoda ,  Akira Umise ,  Kenji Goto

IPC: C22F1/00 ,  A61L27/04 ,  A61L27/50 ,  A61L29/02 ,  A61L29/14 ,  A61L31/02 ,  A61L31/14 ,  C22C5/02 ,  C22F1/14

CPC classification number: C22F1/006 ,  A61L27/047 ,  A61L27/50 ,  A61L29/02 ,  A61L29/14 ,  A61L31/022 ,  A61L31/14 ,  C22C5/02 ,  C22F1/14 ,  A61L2400/16 ,  A61L2430/12

Abstract: The present invention provides a shape-memory alloy including a Au—Cu—Al alloy having 20 at % or more and 40 at % or less Cu and 15 at % or more and 30 at % or less Al, with the balance being Au and inevitable impurities. The shape-memory alloy has a Vickers hardness of 360 Hv or less. The Au—Cu—Al alloy of the present invention is an alloy capable of developing both biocompatibility and a shape-memory effect, and further capable of achieving artifactlessness in a magnetic environment. The Au—Cu—Al alloy can be produced by heat-treating a clad material formed of a combination of a hollow material made of a Au—Cu alloy and a core material made of metallic Al at 500° C. or more and 700° C. or less.

公开(公告)号：US12084784B2

公开(公告)日：2024-09-10

申请号：US18248482

申请日：2021-08-10

Applicant: Heraeus Materials Singapore Pte. Ltd.

Inventor： Miew Wan Lo ,  Murali Sarangapani

IPC: C25D7/06 ,  C22C1/02 ,  C22C5/02 ,  C22C5/06 ,  C22F1/14 ,  C25D3/12 ,  C25D3/48 ,  C25D3/50 ,  C25D5/10 ,  C25D5/12 ,  C25D5/34 ,  C25D5/50 ,  H01B5/02 ,  H01B13/00 ,  H01B1/02

CPC classification number: C25D7/0607 ,  C22C1/02 ,  C22C5/02 ,  C22C5/06 ,  C22F1/14 ,  C25D3/12 ,  C25D3/48 ,  C25D3/50 ,  C25D5/10 ,  C25D5/12 ,  C25D5/34 ,  C25D5/50 ,  H01B5/02 ,  H01B13/0016 ,  H01B1/02 ,  Y10T428/12875

Abstract: A wire comprising a silver-based wire core having a double-layer coating comprised of an inner layer of palladium or nickel and an adjacent outer layer of gold, wherein the wire exhibits at least one of the intrinsic properties A1) to A3):



A1) the average grain size of the crystal grains in the wire core, measured in longitudinal direction, is in the range of from 0.7 to 1.1 μm;
A2) the fraction of twin boundaries, measured in longitudinal direction of the wire, is in the range of from 5 to 40%; and,
A3) 20 to 70% of the crystal grains of the wire core are oriented in direction, and 3 to 40% of the crystal grains of the wire core are oriented in direction, each % with respect to the total number of crystal grains with orientation parallel to the drawing direction of the wire.

公开(公告)号：US20230407438A1

公开(公告)日：2023-12-21

申请号：US18252144

申请日：2021-07-23

Applicant: Omega SA

Inventor： Denis VINCENT ,  Stéphane LAUPER ,  Gregory KISSLING

IPC: C22C5/02 ,  G04B37/22 ,  A44C27/00

CPC classification number: C22C5/02 ,  G04B37/22 ,  A44C27/003

Abstract: A gold alloy may contain, by weight, between 73% and 77% of gold, between 5% and 11% of silver, between 1% and 7% of palladium, and between 10% and 18% of copper. The gold alloy may include iridium, rhenium, and/or ruthenium in up to 0.05 wt. %. The gold alloy may have an a* value in a range of from 3 to 9, and a b* value in a range of from 12 to 18, in CIELAB color space. A timepiece, piece of jewelry, or gemstone jewelry, may be made of such a gold alloy.

公开(公告)号：US11826833B2

公开(公告)日：2023-11-28

申请号：US17185418

申请日：2021-02-25

Applicant: BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM

Inventor： Simon M. Humphrey ,  Stephany Garcia

IPC: B22F9/24 ,  B01J37/34 ,  B01J23/48 ,  B01J23/89 ,  B01J35/00 ,  B01J23/40 ,  B01D53/86 ,  B22F1/054 ,  C22C1/047 ,  B01J23/42 ,  B01J23/44 ,  B01J23/46 ,  B01J23/50 ,  B01J23/52 ,  B01J35/02 ,  B01J37/06 ,  B01J37/16 ,  C22C5/02 ,  C22C5/04 ,  C22C5/06

CPC classification number: B22F9/24 ,  B01D53/8628 ,  B01J23/40 ,  B01J23/42 ,  B01J23/44 ,  B01J23/464 ,  B01J23/48 ,  B01J23/50 ,  B01J23/52 ,  B01J23/89 ,  B01J35/0013 ,  B01J35/026 ,  B01J37/06 ,  B01J37/16 ,  B01J37/346 ,  B22F1/054 ,  C22C1/047 ,  C22C5/02 ,  C22C5/04 ,  C22C5/06 ,  B01D2255/102 ,  B01D2255/104 ,  B01D2255/106 ,  B01D2255/9202 ,  B22F2999/00 ,  B22F9/24 ,  B22F2999/00 ,  B22F2201/01 ,  B22F2202/11

Abstract: The present invention provides compositions and methods of making bimetallic metal alloys of composition for example, Rh/Pd; Rh/Pt; Rh/Ag; Rh/Au; Rh/Ru; Rh/Co; Rh/Ir; Rh/Ni; Ir/Pd; Ir/Pt; Ir/Ag; Ir/Au; Pd/Ni; Pd/Pt; Pd/Ag; Pd/Au; Pt/Ni; Pt/Ag; Pt/Au; Ni/Ag; Ni/Au; or Ag/Au prepared using microwave irradiation.

公开(公告)号：US11800987B2

公开(公告)日：2023-10-31

申请号：US16334822

申请日：2017-09-20

Applicant: IP2IPO INNOVATIONS LIMITED

Inventor： Mohammad Reza Bahmanyar ,  Christopher Neil McLeod

IPC: A61B5/0215 ,  A61B5/00 ,  B23K35/30 ,  C22C5/02 ,  G01L13/00 ,  H01Q1/27

CPC classification number: A61B5/0215 ,  A61B5/0031 ,  A61B5/686 ,  B23K35/3013 ,  C22C5/02 ,  G01L13/00 ,  H01Q1/273 ,  A61B5/6876

Abstract: An implantable intravascular device for deployment inside a human or animal, the apparatus comprising a body of crystalline material and a membrane of crystalline material fixed to the body by a hermetic bond an assembly of components carried on said crystalline material and arranged for responding to electrical signals wherein the body and the membrane at least partially encapsulate the assembly.

公开(公告)号：US20230295773A1

公开(公告)日：2023-09-21

申请号：US17800674

申请日：2021-06-16

Applicant: EGF - EDUARD G. FIDEL GMBH

Inventor： Kai-F. BINDER ,  Avni BAJRAKTARI

IPC: C22C5/02 ,  C22C1/02 ,  B22D25/06 ,  B22D25/02 ,  B22D11/00 ,  A44C27/00

CPC classification number: C22C5/02 ,  C22C1/02 ,  B22D25/06 ,  B22D25/026 ,  B22D11/001 ,  A44C27/003

Abstract: A piece of jewelry having a copper-containing gold alloy consists of 58.5 to 58.7 wt. % gold, 26.9 to 32.6 wt. % copper, 5.7 to 10.7 wt. % silver, 1.0 to 3.0 wt. % palladium, and a remainder containing 0.7 to 2.2 wt. % zinc.

公开(公告)号：US20190115678A1

公开(公告)日：2019-04-18

申请号：US16159570

申请日：2018-10-12

Applicant: FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD. ,  FOXCONN INTERCONNECT TECHNOLOGY LIMITED

Inventor： JUN ZHAO ,  CAI-YUN ZHANG

IPC: H01R13/03 ,  C22C28/00 ,  C22C5/02 ,  C22C5/04 ,  H01R13/40 ,  H01R13/6471

CPC classification number: H01R13/03 ,  C22C5/02 ,  C22C5/04 ,  C22C28/00 ,  H01R13/40 ,  H01R13/405 ,  H01R13/6471 ,  H01R24/60 ,  H01R2107/00

Abstract: An electrical connector includes: an insulative housing; and a row of contacts secured to the insulative housing, the row of contacts including one or more power contacts and one or more signal and/or ground contacts, wherein the one or more power contacts are plated with a first material and the one or more signal and/or ground contacts are plated with a second material different from the first material. A related method of manufacturing such connector includes separate plating of the row of power contacts from the row of signal and ground contacts with a different material.

公开(公告)号：US20180366153A1

公开(公告)日：2018-12-20

申请号：US15952506

申请日：2018-04-13

Applicant: SEAGATE TECHNOLOGY LLC

Inventor： Yuhang Cheng ,  Tong Zhao ,  Michael C. Kautzky ,  Ed F. Rejda ,  Kurt W. Wierman ,  Scott Franzen ,  Sethuraman Jayashankar ,  Sarbeswar Sahoo ,  Jie Gong ,  Michael Allen Seigler

IPC: G11B13/08 ,  G11B7/24059 ,  C01F7/00 ,  C01G5/00 ,  C22C5/02 ,  C22C5/06 ,  C22C9/02 ,  C22C9/08 ,  C22C11/04 ,  C22C13/00 ,  C22C18/02 ,  C22C19/03 ,  C22C20/00 ,  C22C21/00 ,  C22C21/02 ,  G11B7/1387 ,  G11B5/60 ,  G11B5/48 ,  G11B5/31 ,  C23C14/58 ,  C22C38/06 ,  C22C27/06 ,  C22C27/02 ,  C22C27/00 ,  C22C22/00 ,  C22C21/10 ,  C22C9/04 ,  G11B5/00 ,  C22C9/05 ,  C22C28/00 ,  C22C30/02 ,  C22C9/06 ,  B32B15/01 ,  C22C9/10 ,  C22C21/06 ,  C22C5/10 ,  C22C9/00 ,  C22C24/00 ,  C22C5/04 ,  C22C19/07

CPC classification number: G11B13/08 ,  B32B15/01 ,  B32B15/018 ,  C01F7/00 ,  C01G5/00 ,  C22C5/02 ,  C22C5/04 ,  C22C5/06 ,  C22C5/10 ,  C22C9/00 ,  C22C9/02 ,  C22C9/04 ,  C22C9/05 ,  C22C9/06 ,  C22C9/08 ,  C22C9/10 ,  C22C11/04 ,  C22C13/00 ,  C22C18/02 ,  C22C19/03 ,  C22C19/07 ,  C22C20/00 ,  C22C21/00 ,  C22C21/003 ,  C22C21/02 ,  C22C21/06 ,  C22C21/10 ,  C22C22/00 ,  C22C24/00 ,  C22C27/00 ,  C22C27/02 ,  C22C27/025 ,  C22C27/06 ,  C22C28/00 ,  C22C30/02 ,  C22C38/06 ,  C23C14/5833 ,  G11B5/3106 ,  G11B5/314 ,  G11B5/3163 ,  G11B5/4866 ,  G11B5/6088 ,  G11B7/1387 ,  G11B7/24059 ,  G11B2005/0021

Abstract: A device including a near field transducer, the near field transducer including gold (Au) and at least one other secondary atom, the at least one other secondary atom selected from: boron (B), bismuth (Bi), indium (In), sulfur (S), silicon (Si), tin (Sn), hafnium (Hf), niobium (Nb), manganese (Mn), antimony (Sb), tellurium (Te), carbon (C), nitrogen (N), and oxygen (O), and combinations thereof; erbium (Er), holmium (Ho), lutetium (Lu), praseodymium (Pr), scandium (Sc), uranium (U), zinc (Zn), and combinations thereof; and barium (Ba), chlorine (Cl), cesium (Cs), dysprosium (Dy), europium (Eu), fluorine (F), gadolinium (Gd), germanium (Ge), hydrogen (H), iodine (I), osmium (Os), phosphorus (P), rubidium (Rb), rhenium (Re), selenium (Se), samarium (Sm), terbium (Tb), thallium (Th), and combinations thereof.

公开(公告)号：US20180126456A1

公开(公告)日：2018-05-10

申请号：US15699757

申请日：2017-09-08

Applicant: Kang Pyo So ,  Ju Li

Inventor： Kang Pyo So ,  Ju Li

IPC: B22F3/105 ,  C01B32/168 ,  C09C1/44 ,  C01B32/182 ,  C22C21/18 ,  C22C21/16 ,  C22C21/14 ,  C22C26/00

CPC classification number: B22F3/105 ,  B22F2201/10 ,  B22F2301/052 ,  B22F2302/403 ,  B22F2998/10 ,  B22F2999/00 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/168 ,  C01B32/182 ,  C01B32/956 ,  C01B2202/06 ,  C09C1/44 ,  C22C5/02 ,  C22C21/00 ,  C22C21/14 ,  C22C21/16 ,  C22C21/18 ,  C22C26/00 ,  C22C2026/002 ,  Y10S977/752 ,  Y10S977/90 ,  C22C1/055 ,  B22F3/20

Abstract: A metal-nanostructure composite includes a nanostructure-metal matrix composite. The nanostructure-metal matrix composite includes a host metal and nanofiller dispersed in the grains of the metal. The nanofillers can include both one-dimensional nanostructures (e.g., nano-tubes, nano-rods, nano-pillars, etc.) and two-dimensional nanostructures (e.g., graphene, nano-foam, nano-mesh, etc.) to improve the radiation resistance and mechanical properties of the host metal. A method of manufacturing the metal-nanostructure composite includes obtaining carbon nanotubes (CNTs) and encapsulating the CNTs with metal particles. The method also includes consolidating the encapsulated CNTs and forming (e.g., via extrusion) the consolidated metal/CNTs to produce the metal-nanostructure composite.