公开(公告)号：US10518503B2

公开(公告)日：2019-12-31

申请号：US15969922

申请日：2018-05-03

申请人： ITEQ CORPORATION

发明人： Ta-Yuan Yu ,  Kai-Yang Chen ,  Yen-Hsing Wu

IPC分类号： B32B5/26 ,  B32B15/14 ,  B32B15/20 ,  H05K1/03

摘要： A laminated substrate including a halogen-free epoxy resin composition. The halogen-free epoxy resin composition includes 100 parts by weight of a halogen-free naphthalene type epoxy resin, 10 to 25 parts by weight of a DOPO modified curing agent, 25 to 45 parts by weight of a cyanate resin, 35 to 60 parts by weight of bismaleimide, 45 to 65 parts by weight of a non-DOPO flame retardant, and 0.5 to 15 parts by weight of a curing accelerator. The laminated substrate of the present disclosure includes a halogen-free epoxy resin composition which has the characteristic of high transition temperature, so that the halogen-free epoxy resin composition has low dielectric constant, low dissipation factor, high heat resistance and high storage modulus.