公开(公告)号：US10456851B2

公开(公告)日：2019-10-29

申请号：US14802351

申请日：2015-07-17

Applicant: Illinois Tool Works Inc.

Inventor： Brian J. Borneman ,  Andrew J Henry

IPC: B23K9/10 ,  B23K9/32 ,  H05K3/28 ,  H05K7/14 ,  H05K7/20 ,  B23K9/16

Abstract: A method and apparatus for providing welding type power is disclosed. At least one circuit board is used that is partially potted using a potting barrier affixed to the circuit board. The partially potted portion can be inside an enclosed air flow space.

公开(公告)号：US20170014934A1

公开(公告)日：2017-01-19

申请号：US14802351

申请日：2015-07-17

Applicant: Illinois Tool Works Inc.

Inventor： Brian J. Borneman ,  Andrew J. Henry

IPC: B23K9/10 ,  H05K1/02 ,  H05K3/30 ,  H05K1/18

CPC classification number: B23K9/1043 ,  B23K9/16 ,  B23K9/32 ,  H05K3/284 ,  H05K7/1432 ,  H05K7/20918 ,  H05K2201/09972 ,  H05K2201/2018 ,  H05K2203/1316

Abstract: A method and apparatus for providing welding type power is disclosed. At least one circuit board is used that is partially potted using a potting barrier affixed to the circuit board. The partially potted portion can be inside an enclosed air flow space.

Abstract translation: 公开了一种用于提供焊接型电力的方法和装置。 使用至少一个电路板，其使用固定到电路板的封装屏障部分地封装。 部分封装的部分可以在封闭的空气流动空间内。