公开(公告)号：US10265745B2

公开(公告)日：2019-04-23

申请号：US14584945

申请日：2014-12-29

Applicant: Illinois Tool Works Inc.

Inventor： Louis M. Spoto ,  Dean J. Randazzo ,  Matthew J. Deschner ,  William A. Herring ,  Shannon K. Crawford-Taylor ,  Suwit Sangkaratana ,  Paul R. Jelonek ,  Alan J. Varacins

IPC: B21B27/03 ,  B21B27/00 ,  B31F1/07 ,  B41N6/00 ,  B44B5/00 ,  B44B5/02 ,  B21B27/02 ,  B29C59/02 ,  B29C59/04

Abstract: A seamless, embossed or cast substrate is formed using a seamless sleeve having a seamless surface relief formed thereon and configured to slide over an cylindrical base in an embossing or casting assembly. The substrate is a flat web, foil, or film of, for example, paper, polyester, polypropylene, metal or other elongated flat material. The surface relief can be applied through interfering ablation, non-interfering ablation, ink jet printing, or other techniques wherein a seamless surface relief is formed onto the seamless sleeve. A method of making a seamless, embossed or cast substrate includes expanding a diameter of a seamless sleeve having a seamless surface relief formed thereon, sliding the expanded seamless sleeve onto a cylindrical base, allowing the diameter of the seamless sleeve to contract around the cylindrical base, and conveying a substrate through the embossing or casting assembly and embossing or casting the seamless surface relief into the substrate.

公开(公告)号：US20150114062A1

公开(公告)日：2015-04-30

申请号：US14584945

申请日：2014-12-29

Applicant: Illinois Tool Works Inc.

Inventor： Louis M. Spoto ,  Dean J. Randazzo ,  Matthew J. Deschner ,  William A. Herring ,  Shannon K. Crawford-Taylor ,  Suwit Sangkaratana ,  Paul R. Jelonek ,  Alan J. Varacins

IPC: B21B27/00 ,  B21B27/02 ,  B29C59/02

CPC classification number: B21B27/005 ,  B21B27/02 ,  B29C59/026 ,  B29C59/04 ,  B31F1/07 ,  B31F2201/0723 ,  B41N6/00 ,  B44B5/0047 ,  B44B5/0052 ,  B44B5/026 ,  Y10T29/49563 ,  Y10T428/12292 ,  Y10T428/12389 ,  Y10T428/13 ,  Y10T428/131 ,  Y10T428/139 ,  Y10T428/1393 ,  Y10T428/24479 ,  Y10T428/24521

Abstract: A seamless, embossed or cast substrate is formed using a seamless sleeve having a seamless surface relief formed thereon and configured to slide over an cylindrical base in an embossing or casting assembly. The substrate is a flat web, foil, or film of, for example, paper, polyester, polypropylene, metal or other elongated flat material. The surface relief can be applied through interfering ablation, non-interfering ablation, ink jet printing, or other techniques wherein a seamless surface relief is formed onto the seamless sleeve. A method of making a seamless, embossed or cast substrate includes expanding a diameter of a seamless sleeve having a seamless surface relief formed thereon, sliding the expanded seamless sleeve onto a cylindrical base, allowing the diameter of the seamless sleeve to contract around the cylindrical base, and conveying a substrate through the embossing or casting assembly and embossing or casting the seamless surface relief into the substrate.

Abstract translation: 使用在其上形成有无缝表面浮雕的无缝套筒形成无缝的，压花的或铸造的基底，并且构造成在压花或铸造组件中在圆柱形基座上滑动。 基材是例如纸，聚酯，聚丙烯，金属或其它细长扁平材料的扁平网状物，箔或膜。 表面浮雕可以通过干涉消融，非干涉消融，喷墨印刷或其它技术施加，其中在无缝套管上形成无缝的表面浮雕。 制造无缝，压花或铸造基片的方法包括使形成有无缝表面凹凸的无缝套管的直径扩大，将扩展的无缝套筒滑动到圆柱形基座上，允许无缝套筒的直径在圆柱形基座 并且通过压花或铸造组件输送基底并将无缝表面浮雕压花或铸造到基底中。