公开(公告)号：US20100090780A1

公开(公告)日：2010-04-15

申请号：US12588432

申请日：2009-10-15

申请人： In Sang Song ,  Chul Soon Park ,  Dong Yun Jung ,  Ki Chan Eun ,  Jae Jin Lee ,  Seong Jun Cho

发明人： In Sang Song ,  Chul Soon Park ,  Dong Yun Jung ,  Ki Chan Eun ,  Jae Jin Lee ,  Seong Jun Cho

IPC分类号： H01P1/18

CPC分类号： H01P1/184

摘要： A phase shifter includes a substrate; a signal line formed on a specific region in an upper surface of the substrate; and an air gap which is formed within the substrate and changes effective permittivity of the substrate to delay phase of a signal supplied to the signal line. The phase shifter delays a phase of a signal by controlling effective permittivity using an air gap, thereby having outstandingly low insertion loss as compared to existing phase shifters. Further, the phase shifter can be manufactured in a same length as a reference line so that the phase shifter can be in a compact size.

摘要翻译： 移相器包括基板; 形成在所述基板的上表面的特定区域上的信号线; 以及形成在衬底内的气隙，并且改变衬底的有效介电常数以延迟提供给信号线的信号的相位。 移相器通过使用气隙控制有效介电常数来延迟信号的相位，从而与现有的移相器相比具有非常低的插入损耗。 此外，移相器可以制造成与参考线相同的长度，使得移相器可以是紧凑的尺寸。

公开(公告)号：US08022784B2

公开(公告)日：2011-09-20

申请号：US12433116

申请日：2009-04-30

申请人： Jae Jin Lee ,  Chul Soon Park ,  Dong Yun Jung ,  Ki Chan Eun

发明人： Jae Jin Lee ,  Chul Soon Park ,  Dong Yun Jung ,  Ki Chan Eun

IPC分类号： H01P5/107

CPC分类号： H01P5/107

摘要： A wireless communication module includes a plurality of monolithic millimeter-wave integrated circuits (MMICs) for signal processing attached to the top surface of a multi-layer low temperature co-fired ceramic substrate; a planar transmission line formed on the top surface of the multi-layer substrate for communications between the MMICs; a metal base attached to the bottom surface of the multi-layer substrate and having an opening to which an antenna is attached; a plurality of vias for connecting the metal base and the planar transmission line within the multi-layer substrate to establish a uniform potential on a ground plane of the multi-layer substrate; an embedded waveguide formed in the opening surrounded with the vias within the multi-layer substrate; and a planar transmission line-to-waveguide transition apparatus for the transition of waves between the planar transmission line and the embedded waveguide.

摘要翻译： 无线通信模块包括多个单层毫米波集成电路（MMIC），用于信号处理，附接到多层低温共烧陶瓷衬底的顶表面; 形成在所述多层基板的上表面上用于MMIC之间的通信的平面传输线; 金属基底，附着在多层基板的底面上，并具有安装有天线的开口; 用于连接多层基板内的金属基底和平面传输线的多个通孔，以在多层基底的接地平面上建立均匀的电位; 在所述开口中形成的嵌入式波导，所述开口被所述多层基板内的通孔包围; 以及用于在平面传输线和嵌入式波导之间转换波的平面传输线到波导转换装置。

公开(公告)号：US20100001808A1

公开(公告)日：2010-01-07

申请号：US12433116

申请日：2009-04-30

申请人： Jae Jin LEE ,  Chul Soon Park ,  Dung Yun Jung ,  Ki Chan Eun

发明人： Jae Jin LEE ,  Chul Soon Park ,  Dung Yun Jung ,  Ki Chan Eun

IPC分类号： H01P5/107

CPC分类号： H01P5/107

摘要： A wireless communication module includes a plurality of monolithic millimeter-wave integrated circuits (MMICs) for signal processing attached to the top surface of a multi-layer low temperature co-fired ceramic substrate; a planar transmission line formed on the top surface of the multi-layer substrate for communications between the MMICs; a metal base attached to the bottom surface of the multi-layer substrate and having an opening to which an antenna is attached; a plurality of vias for connecting the metal base and the planar transmission line within the multi-layer substrate to establish a uniform potential on a ground plane of the multi-layer substrate; an embedded waveguide formed in the opening surrounded with the vias within the multi-layer substrate; and a planar transmission line-to-waveguide transition apparatus for the transition of waves between the planar transmission line and the embedded waveguide.

摘要翻译： 无线通信模块包括多个单层毫米波集成电路（MMIC），用于信号处理，附接到多层低温共烧陶瓷衬底的顶表面; 形成在所述多层基板的上表面上用于MMIC之间的通信的平面传输线; 金属基底，附着在多层基板的底面上，并具有安装有天线的开口; 用于连接多层基板内的金属基底和平面传输线的多个通孔，以在多层基底的接地平面上建立均匀的电位; 在所述开口中形成的嵌入式波导，所述开口被所述多层基板内的通孔包围; 以及用于在平面传输线和嵌入式波导之间转换波的平面传输线到波导转换装置。