公开(公告)号：US20240088004A1

公开(公告)日：2024-03-14

申请号：US18452566

申请日：2023-08-21

Applicant: Industrial Technology Research Institute

Inventor： Tai-Jui Wang ,  Jui-Wen Yang ,  Chieh-Wei Feng ,  Chih Wei Lu ,  Hsien-Wei Chiu

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/15

CPC classification number: H01L23/49822 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838

Abstract: A stacked wiring structure includes a first wiring substrate and a second wiring substrate. The first wiring substrate includes a first glass substrate, multiple first conductive through vias penetrating through the first glass substrate, and a first multi-layered redistribution wiring structure disposed on the first glass substrate. The second wiring substrate includes a second glass substrate, multiple second conductive through vias penetrating through the second glass substrate, and a second multi-layered redistribution wiring structure disposed on the second glass substrate. The first conductive through vias are electrically connected to the second conductive through vias. The first glass substrate is spaced apart from the second glass substrate. The first multi-layered redistribution wiring structure is spaced apart from the second multi-layered redistribution wiring structure by the first glass substrate and the second glass substrate.