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    SENSING SYSTEM
    1.
    发明申请
    SENSING SYSTEM 审中-公开

    公开(公告)号：US20180342461A1

    公开(公告)日：2018-11-29

    申请号：US15705277

    申请日：2017-09-15

    Applicant: Industrial Technology Research Institute

    Inventor： Chun-Ting Liu ,  Shih-Ming Lin ,  Je-Ping Hu ,  Jung-Shiuan Liou

    IPC: H01L23/538 ,  H01L23/15 ,  H01L21/48 ,  H01L25/18 ,  H01L23/66

    Abstract: A sensing system including a substrate, at least one explicit device, at least one inner operation device, a plurality of conductors, and a plurality of conductive traces is provided. The substrate has a first surface and a second surface opposite to the first surface, and has a plurality of vias communicating the first surface and the second surface. The explicit device is disposed on the first surface. The explicit device includes a display, a sensor, or a combination thereof. The inner operation device is totally disposed on the second surface. The inner operation device includes a signal processor, a driver, or a combination thereof. The conductors are disposed in the vias, respectively, and connect the at least one explicit device with the at least one inner operation device. The conductive traces are disposed on at least one of the first surface and the second surface.

    ORGANIC LIGHT-EMITTING DEVICE
    3.
    发明申请
    ORGANIC LIGHT-EMITTING DEVICE 有权
    有机发光装置

    公开(公告)号：US20170069703A1

    公开(公告)日：2017-03-09

    申请号：US15255156

    申请日：2016-09-02

    Applicant: Industrial Technology Research Institute

    Inventor： Hsi-Hsuan Yen ,  Wen-Yung Yeh ,  Je-Ping Hu ,  Yuan-Shan Chung ,  Chih-Ming Lai ,  Hsuan-Yu Lin ,  Wen-Hong Liu ,  Hsin-Chu Chen ,  Chun-Ting Liu

    IPC: H01L27/32 ,  H01L23/525

    CPC classification number: H01L27/3276 ,  H01L23/5256 ,  H01L27/3202 ,  H01L27/3288 ,  H01L51/5203 ,  H01L2251/5361 ,  H01L2251/568

    Abstract: An organic light-emitting device includes a first substrate, a light-emitting structure layer, a first electrode layer, a second electrode layer, a second substrate, first conduction members, a second conduction member and protection structures. The light-emitting structure layer is disposed on the first substrate. The first electrode layer is disposed on the light-emitting structure layer and includes pad-like patterns. The second electrode layer is disposed between the light-emitting structure layer and the first substrate. The second substrate is adhered on the first electrode layer and includes a first circuit and a second circuit. The first circuit includes a continuous pattern and contact portions. The first conduction members are connected between the first circuit and the first electrode layer. The second conduction member is connected between the second circuit and the second electrode layer. The protection structures respectively form open circuits or close circuits between the contact portions and the continuous pattern.

    Abstract translation: 有机发光器件包括第一衬底，发光结构层，第一电极层，第二电极层，第二衬底，第一导电构件，第二导电构件和保护结构。 发光结构层设置在第一基板上。 第一电极层设置在发光结构层上并且包括衬垫状图案。 第二电极层设置在发光结构层和第一基板之间。 第二基板粘附在第一电极层上并且包括第一电路和第二电路。 第一电路包括连续图案和接触部分。 第一导电构件连接在第一电路和第一电极层之间。 第二导电构件连接在第二电路和第二电极层之间。 保护结构分别在接触部分和连续图案之间形成开路或闭合电路。

    Organic light-emitting device
    6.
    发明授权
    Organic light-emitting device 有权

    公开(公告)号：US09865671B2

    公开(公告)日：2018-01-09

    申请号：US15255156

    申请日：2016-09-02

    Applicant: Industrial Technology Research Institute

    Inventor： Hsi-Hsuan Yen ,  Wen-Yung Yeh ,  Je-Ping Hu ,  Yuan-Shan Chung ,  Chih-Ming Lai ,  Hsuan-Yu Lin ,  Wen-Hong Liu ,  Hsin-Chu Chen ,  Chun-Ting Liu

    IPC: H01L27/32 ,  H01L23/525

    CPC classification number: H01L27/3276 ,  H01L23/5256 ,  H01L27/3202 ,  H01L27/3288 ,  H01L51/5203 ,  H01L2251/5361 ,  H01L2251/568

    Abstract: An organic light-emitting device includes a first substrate, a light-emitting structure layer, a first electrode layer, a second electrode layer, a second substrate, first conduction members, a second conduction member and protection structures. The light-emitting structure layer is disposed on the first substrate. The first electrode layer is disposed on the light-emitting structure layer and includes pad-like patterns. The second electrode layer is disposed between the light-emitting structure layer and the first substrate. The second substrate is adhered on the first electrode layer and includes a first circuit and a second circuit. The first circuit includes a continuous pattern and contact portions. The first conduction members are connected between the first circuit and the first electrode layer. The second conduction member is connected between the second circuit and the second electrode layer. The protection structures respectively form open circuits or close circuits between the contact portions and the continuous pattern.

    ILLUMINATION DEVICE AND METHOD OF FABRICATING AN ILLUMINATION DEVICE
    7.
    发明申请
    ILLUMINATION DEVICE AND METHOD OF FABRICATING AN ILLUMINATION DEVICE 审中-公开
    照明装置和制造照明装置的方法

    公开(公告)号：US20160155945A1

    公开(公告)日：2016-06-02

    申请号：US14949905

    申请日：2015-11-24

    Applicant: Industrial Technology Research Institute

    Inventor： Hsuan-Yu Lin ,  Hsin-Chu Chen ,  Wen-Hong Liu ,  Chao-Feng Sung ,  Chun-Ting Liu ,  Je-Ping Hu ,  Wen-Yung Yeh

    IPC: H01L51/00 ,  H01R13/62 ,  H01R12/70 ,  H01L51/52 ,  H01L51/56

    CPC classification number: H01L51/0024 ,  H01L51/5203 ,  H01L51/5237 ,  H01L51/5246 ,  H01L51/56 ,  H01R12/7076 ,  H01R13/6205

    Abstract: An illumination device includes a substrate, a light emitting structure, a sealant, and a laminating board is provided. The light emitting structure includes a first electrode layer, a light emitting layer and a second electrode layer stacked on the substrate sequentially. The sealant covers the light emitting structure. The laminating board is attached to the substrate. The sealant is located between the laminating board and the substrate. The laminating board includes a carrier body, a metal layer and a plurality of pads. The metal layer is exposed at a first surface of the carrier body, is in contact with the sealant and shields an area of the light emitting layer of the light emitting structure. The pads are exposed at the first surface of the carrier body and electrically connected to the first electrode layer and the second electrode layer. The metal layer is electrically isolated from the pads.

    Abstract translation: 照明装置包括基板，发光结构，密封剂和层压板。 发光结构包括依次堆叠在基板上的第一电极层，发光层和第二电极层。 密封剂覆盖发光结构。 层压板附着在基板上。 密封剂位于层压板和基板之间。 层压板包括载体主体，金属层和多个焊盘。 金属层在载体主体的第一表面露出，与密封剂接触并屏蔽发光结构的发光层的一个区域。 焊盘在载体主体的第一表面处露出并电连接到第一电极层和第二电极层。 金属层与焊盘电隔离。

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