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公开(公告)号：US12061741B2
公开(公告)日：2024-08-13
申请号：US17857044
申请日：2022-07-04
Applicant: Industrial Technology Research Institute
Inventor： Hsuan-Yu Lin , Cheng-Yen Tsai
CPC classification number: G06F3/016 , G06F3/014 , G06F9/30018 , H04W4/80
Abstract: An embedded system and a vibration driving method are provided. The embedded system includes a vibration module, a Bluetooth module, a storage module, and a microcontroller unit. The vibration module includes a plurality of actuators. The Bluetooth module is configured to receive a Bluetooth signal provided by an external device. The storage module is configured to store a vibration type database. The microcontroller unit is coupled to the vibration module, the Bluetooth module, and the storage module. The microcontroller unit generates vibration type data according to the Bluetooth signal and the vibration type database. The microcontroller unit drives at least one of the plurality of actuators according to the vibration type data.
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公开(公告)号：US20230205317A1
公开(公告)日：2023-06-29
申请号：US17857044
申请日：2022-07-04
Applicant: Industrial Technology Research Institute
Inventor： Hsuan-Yu Lin , Cheng-Yen Tsai
CPC classification number: G06F3/016 , G06F3/014 , G06F9/30018 , H04W4/80
Abstract: An embedded system and a vibration driving method are provided. The embedded system includes a vibration module, a Bluetooth module, a storage module, and a microcontroller unit. The vibration module includes a plurality of actuators. The Bluetooth module is configured to receive a Bluetooth signal provided by an external device. The storage module is configured to store a vibration type database. The microcontroller unit is coupled to the vibration module, the Bluetooth module, and the storage module. The microcontroller unit generates vibration type data according to the Bluetooth signal and the vibration type database. The microcontroller unit drives at least one of the plurality of actuators according to the vibration type data.
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公开(公告)号：US11579176B2
公开(公告)日：2023-02-14
申请号：US16729485
申请日：2019-12-30
Applicant: Industrial Technology Research Institute
Inventor： Hsuan-Yu Lin
IPC: G01R23/167
Abstract: A sensing system and a sensing signal measuring method thereof are provided. The sensing system includes a signal source, a connecting device, a frequency sweep circuit, and a controller. In the method, the signal source is activated to generate a specific signal. The controller controls the frequency sweep circuit to switch a frequency band of a frequency sweep signal to a first frequency band corresponding to each of a plurality of types of multi-point sensors. The controller receives a sensor signal of each multi-point sensor through the connecting device, where the sensor signal is a variation of a measurement signal output by each multi-point sensor in response to the specific signal and the frequency sweep signal. The controller executes an adaptive algorithm on the sensor signal to construct a correspondence between an eigenvalue of each multi-point sensor and a location of the first frequency band, and records the correspondence.
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公开(公告)号：US20170148964A1
公开(公告)日：2017-05-25
申请号：US15293298
申请日：2016-10-14
Applicant: Industrial Technology Research Institute
Inventor： Hsin-Chu Chen , Wen-Yung Yeh , Hsuan-Yu Lin , Chun-Ting Liu , Wen-Hong Liu
CPC classification number: H01L33/62 , H01L33/52 , H01L51/5203 , H01L51/524 , H01L2251/5369
Abstract: A light-emitting assembly includes a first substrate, a first electrode layer, a light-emitting layer, a second electrode layer, a second substrate, a first conductive member and a second conductive member. The first electrode layer, the light-emitting layer and the second electrode layer are sequentially disposed on the first substrate. An area of the second electrode layer is entirely located within an area of the light emitting layer. The second electrode layer is located between the second substrate and the light-emitting layer. The first and second conductive members are disposed between the first and second substrates. The first electrode layer is electrically connected to a first circuit on the second substrate through the first conductive member. The second electrode layer is electrically connected to a second circuit on the second substrate through the second conductive member. The second conductive member is located within the area of the second electrode layer.
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公开(公告)号：US11296696B2
公开(公告)日：2022-04-05
申请号：US16727851
申请日：2019-12-26
Applicant: Industrial Technology Research Institute
Inventor： Hsuan-Yu Lin
Abstract: A detection apparatus and a detecting method thereof are provided. In the method, an input impedance structure, a sensing impedance structure and an output impedance structure are provided. The sensing impedance structure is connected to the input impedance structure. At least two impedances are formed in the sensing impedance structure. The output impedance structure is connected to the sensing impedance structure. At least three discontinuous impedance surfaces are formed in the input impedance structure, the sensing impedance structure and the output impedance structure. A detection signal is inputted into the input impedance structure, and the detection signal passes through the three impedance structures. Then, a variation of at least one of the discontinuous impedance surfaces can be determined according to the outputted detection signal from the output impedance structure.
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Patent Agency Ranking
公开(公告)号：US09865671B2
公开(公告)日：2018-01-09
申请号：US15255156
申请日：2016-09-02
Applicant: Industrial Technology Research Institute
Inventor： Hsi-Hsuan Yen , Wen-Yung Yeh , Je-Ping Hu , Yuan-Shan Chung , Chih-Ming Lai , Hsuan-Yu Lin , Wen-Hong Liu , Hsin-Chu Chen , Chun-Ting Liu
IPC: H01L27/32 , H01L23/525
CPC classification number: H01L27/3276 , H01L23/5256 , H01L27/3202 , H01L27/3288 , H01L51/5203 , H01L2251/5361 , H01L2251/568
Abstract: An organic light-emitting device includes a first substrate, a light-emitting structure layer, a first electrode layer, a second electrode layer, a second substrate, first conduction members, a second conduction member and protection structures. The light-emitting structure layer is disposed on the first substrate. The first electrode layer is disposed on the light-emitting structure layer and includes pad-like patterns. The second electrode layer is disposed between the light-emitting structure layer and the first substrate. The second substrate is adhered on the first electrode layer and includes a first circuit and a second circuit. The first circuit includes a continuous pattern and contact portions. The first conduction members are connected between the first circuit and the first electrode layer. The second conduction member is connected between the second circuit and the second electrode layer. The protection structures respectively form open circuits or close circuits between the contact portions and the continuous pattern.
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公开(公告)号：US09614187B1
公开(公告)日：2017-04-04
申请号：US15084463
申请日：2016-03-29
Applicant: Industrial Technology Research Institute
Inventor： Wen-Hong Liu , Hsuan-Yu Lin , Hsin-Chu Chen , Chih-Ming Lai
CPC classification number: H01L51/5259 , H01L51/0096 , H01L51/5203 , H01L51/5243 , H01L51/5246 , H01L51/5253 , H01L51/5268 , H01L51/56 , Y02E10/549
Abstract: An electronic device package including a substrate, a base film, a first seal, an electronic device and a second seal is provided. The first seal is disposed between the substrate and the base film and partially exposed by the base film. The electronic device is formed on the base film. The second seal disposed on the electronic device includes absorbents. A part of the second seal adheres to a part of the first seal exposed by the base film. The first seal and the second seal encapsulate the base film and the electronic device. The first seal and the second seal are the same host materials. A packaging method of an electronic device package is also provided.
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公开(公告)号：US20160148560A1
公开(公告)日：2016-05-26
申请号：US14864910
申请日：2015-09-25
Applicant: Industrial Technology Research Institute
Inventor： Cheng-Yen Tsai , Chih-Ming Lai , Wen-Yung Yeh , Hsuan-Yu Lin
CPC classification number: H01L51/504 , F21K9/00 , H01L27/3269 , H01L51/5278
Abstract: An organic light-emitting diode (OLED) apparatus includes at least one OLED illumination module, a driving unit, an optical sensing module, a control unit, and a storage unit. The driving unit is configured to adjust voltage applied to the OLED illumination module, so as to change a CCT of the OLED illumination module. The optical sensing module is configured to sense the light emitted by the OLED illumination module. The control unit is configured to receive a feedback signal from the optical sensing module so as to adjust a light intensity and the CCT of the OLED illumination module. The storage unit is configured to store photoelectric parameter data of the OLED illumination module. The control unit is configured to adjust the CCT and the light intensity of the OLED illumination module to target values according to the photoelectric parameter data.
Abstract translation: 有机发光二极管（OLED）装置包括至少一个OLED照明模块，驱动单元，光学感测模块，控制单元和存储单元。 驱动单元被配置为调节施加到OLED照明模块的电压，以便改变OLED照明模块的CCT。 光学感测模块被配置为感测由OLED照明模块发射的光。 控制单元被配置为从光学感测模块接收反馈信号，以便调节OLED照明模块的光强度和CCT。 存储单元被配置为存储OLED照明模块的光电参数数据。 控制单元被配置为根据光电参数数据将OLED照明模块的CCT和光强度调整到目标值。
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公开(公告)号：US10461281B2
公开(公告)日：2019-10-29
申请号：US16178617
申请日：2018-11-02
Applicant: Industrial Technology Research Institute
Inventor： Hsuan-Yu Lin , Ting-Yu Wang , Wen-Hung Liu
Abstract: A light emitting device including a substrate, a first electrode, a light emitting layer, a second electrode, a heat shrinkable film and a first adhesive layer is provided. The first electrode is disposed on the substrate. The light emitting layer is disposed on the first electrode. The second electrode is disposed on the light emitting layer. The first electrode, the light emitting layer, and the second electrode are sequentially stacked on the substrate to form a light emitting cell. The heat shrinkable film is disposed on the light emitting cell. The first adhesive layer is disposed between the heat shrinkable film and the second electrode.
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公开(公告)号：US20190305258A1
公开(公告)日：2019-10-03
申请号：US16178617
申请日：2018-11-02
Applicant: Industrial Technology Research Institute
Inventor： Hsuan-Yu Lin , Ting-Yu Wang , Wen-Hung Liu
Abstract: A light emitting device including a substrate, a first electrode, a light emitting layer, a second electrode, a heat shrinkable film and a first adhesive layer is provided. The first electrode is disposed on the substrate. The light emitting layer is disposed on the first electrode. The second electrode is disposed on the light emitting layer. The first electrode, the light emitting layer, and the second electrode are sequentially stacked on the substrate to form a light emitting cell. The heat shrinkable film is disposed on the light emitting cell. The first adhesive layer is disposed between the heat shrinkable film and the second electrode.
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