公开(公告)号：US11667709B2

公开(公告)日：2023-06-06

申请号：US16948563

申请日：2020-09-23

Applicant: Industrial Technology Research Institute

Inventor： Min-Yuan Chou ,  Li-Tsen Lin ,  Chung-Yuan Sun ,  Ya-Ping Lai ,  Chin-Pen Lai ,  Ssu-Yuan Wu ,  Mei-Wei Lin

IPC: C07K16/28 ,  A61P35/00 ,  A61K45/06

CPC classification number: C07K16/2803 ,  A61P35/00 ,  A61K45/06 ,  C07K2317/565 ,  C07K2317/567

Abstract: Antibodies and antigen-binding fragments that bind to TIGIT are disclosed. The disclosure further relates to methods and compositions for use in treating an immune-related disease (e.g., a cancer or an infection or infectious disease) by administering a composition disclosed herein.