Method of bonding by anodic bonding for field emission display
    1.
    发明申请
    Method of bonding by anodic bonding for field emission display 失效
    通过阳极接合进行场发射显示的接合方法

    公开(公告)号:US20040029482A1

    公开(公告)日:2004-02-12

    申请号:US10443636

    申请日:2003-05-22

    CPC classification number: H01J9/025 H01J9/185 Y10T29/49039

    Abstract: A method of bonding spacers to an anode plate of a field emission display. An anode plate having separate phosphor regions is provided, wherein a black matrix material is provided to separate the phosphor regions from one another. A magnetic layer is formed on the black matrix material. A thin metal film is formed on the anode plate and the magnetic layer. Spacers are disposed on the metal film above the black matrix material. An electromagnetic induction procedure is performed to heat the magnetic layer and thus serves as a heating source to produce heat, wherein the heat goes through the metal film to heat the spacers. A direct current (D.C.) electric field procedure is performed to bond the spacers to the metal film above the black matrix material.

    Abstract translation: 将间隔物接合到场发射显示器的阳极板的方法。 提供具有分离的荧光体区域的阳极板,其中提供黑色矩阵材料以将荧光体区域彼此分离。 在黑色矩阵材料上形成磁性层。 在阳极板和磁性层上形成薄金属薄膜。 间隔物设置在黑色矩阵材料上方的金属膜上。 执行电磁感应过程以加热磁性层,从而用作加热源以产生热量,其中热量穿过金属膜以加热间隔物。 执行直流(DC)电场程序以将间隔物粘结到黑色矩阵材料上方的金属膜上。

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