公开(公告)号：US20250081335A1

公开(公告)日：2025-03-06

申请号：US18820222

申请日：2024-08-29

Applicant: Industrial Technology Research Institute

Inventor： Yi-Rong Lin ,  Hsiao-Fen Wei ,  Chung-Wei Wang ,  Li-Wei Yao

IPC: H05K1/02

Abstract: An electronic device includes a surface structure. The surface structure has a curved surface and includes a substrate, a first conductive line, and a first dielectric pattern. The first conductive line is disposed above the substrate. The first dielectric pattern is disposed above the first conductive line and overlaps with the first conductive line. The surface structure has a first region and a second region. The first dielectric pattern in the first region has a first average width, the first dielectric pattern in the second region has a second average width, and the first average width is different from the second average width.