公开(公告)号：US20250081347A1

公开(公告)日：2025-03-06

申请号：US18820278

申请日：2024-08-30

Applicant: Industrial Technology Research Institute

Inventor： Chung-Wei Wang ,  Chen-Tsai Yang ,  Shu-Wei Kuo ,  Min-Hsiung Liang ,  Bor-Chuan Chuang

IPC: H05K1/14 ,  H05K1/11

Abstract: An electrical connection device includes a mother board and a daughter board. The mother board includes a first board body with at least one cavity and a first electrical contact printed on the first board body. The daughter board includes a second board body and a second electrical contact printed on the second board body. At least one of the daughter board and the mother board includes at least one contour feature integrally formed with at least one of the first board body and the second board body. When the second board body is inserted into the at least one cavity of the first board body, the second electrical contact is electrically connected to the first electrical contact, and the daughter board is positioned in the mother board through the at least one contour feature.

公开(公告)号：US20240164008A1

公开(公告)日：2024-05-16

申请号：US18506151

申请日：2023-11-10

Applicant: Industrial Technology Research Institute

Inventor： Li-Wei Yao ,  Hsiao-Fen Wei ,  Chung-Wei Wang ,  Shu-Wei Kuo

IPC: H05K1/02 ,  H01L23/00 ,  H01L23/367 ,  H01L25/075 ,  H01L33/52 ,  H01L33/64 ,  H05K1/18

CPC classification number: H05K1/0209 ,  H01L23/367 ,  H01L24/05 ,  H01L24/16 ,  H01L25/0753 ,  H01L33/52 ,  H01L33/642 ,  H01L33/644 ,  H05K1/181 ,  H01L33/62 ,  H01L2224/05553 ,  H01L2224/16054 ,  H01L2224/16227

Abstract: A molded electronic assembly including a circuit substrate, a plurality of electronic devices, and at least one patterned heat dissipation structure is provided. The circuit substrate includes a substrate and a circuit, where the substrate has a top surface, and the circuit has a plurality of signal contacts distributed on the top surface. The electronic devices are disposed on the circuit substrate, and each of the electronic devices has a plurality of device pins connected to the signal contacts. The at least one patterned heat dissipation structure corresponds to a signal contact of the signal contacts and starts from the corresponding signal contact and extends toward a plurality of directions on the top surface of the substrate.

公开(公告)号：US20250081335A1

公开(公告)日：2025-03-06

申请号：US18820222

申请日：2024-08-29

Applicant: Industrial Technology Research Institute

Inventor： Yi-Rong Lin ,  Hsiao-Fen Wei ,  Chung-Wei Wang ,  Li-Wei Yao

IPC: H05K1/02

Abstract: An electronic device includes a surface structure. The surface structure has a curved surface and includes a substrate, a first conductive line, and a first dielectric pattern. The first conductive line is disposed above the substrate. The first dielectric pattern is disposed above the first conductive line and overlaps with the first conductive line. The surface structure has a first region and a second region. The first dielectric pattern in the first region has a first average width, the first dielectric pattern in the second region has a second average width, and the first average width is different from the second average width.