公开(公告)号：US20130328143A1

公开(公告)日：2013-12-12

申请号：US13911106

申请日：2013-06-06

Applicant: Infeon Technologies AG

Inventor： Thoralf KAUTZSCH ,  Boris BINDER ,  Uwe RUDOLPH ,  Frank HOFFMANN

IPC: B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00626 ,  B81B3/0021 ,  B81B2203/0109 ,  B81B2203/0315 ,  B81C1/00182 ,  B81C2201/0116

Abstract: Embodiments related to semiconductor manufacturing and semiconductor devices with semiconductor structure are described and depicted.

Abstract translation: 描述和描述了与半导体制造相关的实施例和具有半导体结构的半导体器件。