公开(公告)号：US20180003754A1

公开(公告)日：2018-01-04

申请号：US15634588

申请日：2017-06-27

Applicant: Infineon Technologies AG

Inventor： Jochen O. Schrattenecker ,  Oliver Frank ,  Alexander Kaineder

IPC: G01R29/10 ,  G01R31/302 ,  G01S7/40 ,  G01R1/04 ,  H01Q1/32

Abstract: A test set-up for testing a system-in package with an integrated antenna is described herein. According to one exemplary embodiment, the test set-up includes a carrier with an RF probe arranged thereon and a test socket with resilient electric contacts. The test socket is mounted on the carrier and provides an electric contact to interconnects of the package when it is placed on the test socket. The test socket has an opening which is arranged superjacent to the RF probe.

公开(公告)号：US10564202B2

公开(公告)日：2020-02-18

申请号：US15634588

申请日：2017-06-27

Applicant: Infineon Technologies AG

Inventor： Jochen O. Schrattenecker ,  Oliver Frank ,  Alexander Kaineder

IPC: G01R29/10 ,  G01R31/302 ,  G01S7/40 ,  G01R1/04 ,  H01Q1/32

Abstract: A test set-up for testing a system-in package with an integrated antenna is described herein. According to one exemplary embodiment, the test set-up includes a carrier with an RF probe arranged thereon and a test socket with resilient electric contacts. The test socket is mounted on the carrier and provides an electric contact to interconnects of the package when it is placed on the test socket. The test socket has an opening which is arranged superjacent to the RF probe.