公开(公告)号：US20130105992A1

公开(公告)日：2013-05-02

申请号：US13721957

申请日：2012-12-20

Applicant: Infineon Technologies AG

Inventor： Michael Bauer ,  Thomas Engling ,  Alfred Halmerl ,  Angela Kessler ,  Joachim Mahler ,  Wolfgang Schober

IPC: H01L23/538

CPC classification number: H01L23/538 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L25/0657 ,  H01L2224/24051 ,  H01L2224/24145 ,  H01L2224/24146 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06555 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00

Abstract: A semiconductor component including a stack of semiconductor chips, the semiconductor chips being fixed cohesively one on top of another, is disclosed. The contact areas of the semiconductor chips are led as far as the edges of the semiconductor chips and conductor portions extend at least from an upper edge to a lower edge of the edge sides of the semiconductor chips in order to electrically connect the contact area of the stacked semiconductor chips to one another.

Abstract translation: 公开了一种包括半导体芯片的堆叠的半导体部件，半导体芯片一体地固定在另一个之上。 半导体芯片的接触区域被引导直到半导体芯片和导体部分的边缘至少从半导体芯片的边缘侧的上边缘延伸到下边缘，以便电连接半导体芯片的接触区域 堆叠的半导体芯片彼此。