公开(公告)号：US20200149928A1

公开(公告)日：2020-05-14

申请号：US16743364

申请日：2020-01-15

Applicant: Infineon Technologies AG

Inventor： Tobias WERTH ,  Dirk HAMMERSCHMIDT ,  Helmut KOECK ,  Andrea MONTERASTELLI

IPC: G01D5/243 ,  G01D5/244 ,  G01D5/14

Abstract: Magnetic field sensor devices, corresponding systems and corresponding methods are discussed where a plurality of magnetic field sensors senses a magnetic field. An evaluation circuit generates a first signal component associated with a periodicity of a magnetic field, and a second signal component at least for periods of the magnetic field exceeding a threshold period length, the second signal component having a resolution smaller than the first signal component.

公开(公告)号：US20180283905A1

公开(公告)日：2018-10-04

申请号：US15944972

申请日：2018-04-04

Applicant: Infineon Technologies AG

Inventor： Tobias WERTH ,  Dirk HAMMERSCHMIDT ,  Helmut KOECK ,  Andrea MONTERASTELLI

IPC: G01D5/243 ,  G01D5/244

CPC classification number: G01D5/243 ,  G01D5/145 ,  G01D5/244 ,  G01D5/24404 ,  G01D5/2451

Abstract: Magnetic field sensor devices, corresponding systems and corresponding methods are discussed where a plurality of magnetic field sensors senses a magnetic field. An evaluation circuit generates a first signal component associated with a periodicity of a magnetic field, and a second signal component at least for periods of the magnetic field exceeding a threshold period length, the second signal component having a resolution smaller than one half period of the magnetic field.

公开(公告)号：US20220099761A1

公开(公告)日：2022-03-31

申请号：US17548757

申请日：2021-12-13

Applicant: Infineon Technologies AG

Inventor： Dirk HAMMERSCHMIDT ,  Helmut KOECK ,  Andrea MONTERASTELLI ,  Tobias WERTH

IPC: G01R33/02 ,  G01R33/00

Abstract: The present disclosure relates to magnetic field sensor packages, including a sensor housing, a first sensor chip having an integrated first differential magnetic field sensor circuit, the first sensor chip being arranged in the sensor housing, and a second sensor chip having an integrated second differential magnetic field sensor circuit, the second sensor chip being arranged in the sensor housing.

公开(公告)号：US20190120914A1

公开(公告)日：2019-04-25

申请号：US16165565

申请日：2018-10-19

Applicant: Infineon Technologies AG

Inventor： Dirk HAMMERSCHMIDT ,  Helmut KOECK ,  Andrea MONTERASTELLI ,  Tobias WERTH

IPC: G01R33/02

Abstract: The present disclosure relates to magnetic field sensor arrangements, including a sensor housing, a first sensor chip having an integrated first differential magnetic field sensor circuit, the first sensor chip being arranged in the sensor housing, and a second sensor chip having an integrated second differential magnetic field sensor circuit, the second sensor chip being arranged in the sensor housing.